# US 10,373,904 B2 · Semiconductor devices including capacitors, related electronic systems, and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,904 B2 - Document ID: US10373904B2 - Status: Granted - Kind: B2 - Application number: 15/687,830 - Filed: 2017-08-28 - Published: 2019-02-28 - Granted: 2019-08-06 - Earliest claimed: 2017-08-28 - Assignees: Micron Technology, Inc. - Applicants: Micron Technology, Inc. - Inventors: Eric H. Freeman - Web page: https://patentgrep.com/patent/US10373904B2 ## CPC - H10W 20/496: {Capacitor integral with wiring layers} - H10B 41/27: the channels comprising vertical portions, e.g. U-shaped channels - H10B 43/27: the channels comprising vertical portions, e.g. U-shaped channels - H10D 1/042: {using deposition processes to form electrode extensions} - H10D 1/716: {having vertical extensions} - H10W 20/039: {also covering sidewalls of the conductive structures} - H10W 20/046: {the barrier, adhesion or liner layers being associated with interconnections of capacitors} - H10W 20/056: {by filling conductive material into holes, grooves or trenches} - H10B 43/40: characterised by the peripheral circuit region - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10B: ELECTRONIC MEMORY DEVICES - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A semiconductor device includes a capacitor structure. The capacitor structure comprises conductive vias extending through openings in a stack of alternating dielectric materials and first conductive materials, each conductive via comprising a second conductive material extending through the openings and another dielectric material on sidewalls of the openings, first conductive lines in electrical communication with a first group of the conductive vias, and second conductive lines in electrical communication with a second group of the conductive vias. Related semiconductor device, electronic systems, and methods are disclosed. ## Claims ### Claim 1 A semiconductor device, comprising: a capacitor structure, comprising: conductive vias extending through a stack of alternating dielectric materials and first conductive materials, each conductive via comprising a second conductive material extending through the stack of alternating dielectric materials and within another dielectric material on a sidewall of the conductive via; a first conductive line in electrical communication with a first group of the conductive vias; and a second conductive line in electrical communication with a second group of the conductive vias. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein the alternating dielectric materials and first conductive materials comprise at least about 64 alternating regions of the dielectric material and the first conductive material. ### Claim 3 (depends on 1) The semiconductor device of claim 1, wherein the conductive vias each extend through at least about 4 μm of alternating dielectric materials and first conductive materials. ### Claim 4 (depends on 1) The semiconductor device of claim 1, wherein the first group of conductive vias form a portion of a first group of capacitors arranged in parallel with respect to each other and the second group of conductive vias form a portion of a second group of capacitors arranged in parallel with respect to each other. ### Claim 5 (depends on 4) The semiconductor device of claim 4, wherein the first group of capacitors is arranged in series with the second group of capacitors. ### Claim 6 (depends on 1) The semiconductor device of claim 1, wherein the first group of conductive vias includes the same number of conductive vias as the second group of conductive vias. ### Claim 7 (depends on 1) The semiconductor device of claim 1, wherein the first conductive line is in electrical communication with a first electrically conductive lead electrically coupled to a first component of the semiconductor device and the second conductive line is in electrical communication with a second electrically conductive lead electrically coupled to a second component of the semiconductor device. ### Claim 8 (depends on 1) The semiconductor device of claim 1, wherein all surfaces of each portion of the alternating dielectric materials and first conductive materials are surrounded by at least one of the dielectric material and the another dielectric material. ### Claim 9 (depends on 1) The semiconductor device of claim 1, further comprising a memory array region comprising vertical memory cells extending through the stack of alternating dielectric materials and first conductive materials, wherein the memory array region is electrically isolated from the conductive vias. ### Claim 10 (depends on 1) The semiconductor device of claim 1, wherein the conductive vias are electrically isolated from a memory array region of the semiconductor device by a trench filled with a dielectric material. ### Claim 11 (depends on 1) The semiconductor device of claim 1, wherein the dielectric material of the stack of alternating dielectric materials extends from a via region including the conductive vias to a memory array region including vertical memory cells. ### Claim 12 (depends on 1) The semiconductor device of claim 1, wherein the capacitor structure is operably coupled to a power bus and a data bus. ### Claim 13 (depends on 1) The semiconductor device of claim 1, wherein the first conductive materials comprise the same material as a conductive material of word lines in a memory array region of the semiconductor device. ### Claim 14 A semiconductor device, comprising: a first component of an integrated circuit; a second component of the integrated circuit; and a capacitor structure between the first component of the integrated circuit and the second component of the integrated circuit, the capacitor structure comprising: conductive vias extending through alternating first dielectric materials and first conductive materials, each conductive via of the conductive vias including a central portion comprising a second conductive material and a second dielectric material on sidewalls of the second conductive material, the second dielectric material extending along a length of the conductive via, the second conductive material separated from the first conductive materials by the second dielectric material; and capacitors each defined by a portion of the second conductive material, the second dielectric material, and one region of the first conductive material. ### Claim 15 (depends on 14) The semiconductor device of claim 14, wherein the conductive vias are arranged in rows and columns, wherein every other column is in electrical communication with a first conductive line and the other of the every other columns is in electrical communication with a second conductive line. ### Claim 16 (depends on 15) The semiconductor device of claim 15, wherein the first conductive line is in electrical communication with the first component and the second conductive line is in electrical communication with the second component. ### Claim 17 (depends on 14) The semiconductor device of claim 14, further comprising a memory cell region including memory cell pillars extending through the alternating first dielectric materials and first conductive materials. ### Claim 18 (depends on 17) The semiconductor device of claim 17, wherein the memory cell pillars are electrically isolated from the conductive vias by a dielectric material between the memory cell pillars and the conductive vias. ### Claim 19 (depends on 14) The semiconductor device of claim 14, wherein the second dielectric material has a thickness between about 10 nm and about 30 nm. ### Claim 20 (depends on 14) The semiconductor device of claim 14, wherein the capacitor structure comprises a first group of capacitors in electrical communication with the first component and a second group of capacitors in electrical communication with the second component, wherein the first group of capacitors and the second group of capacitors are capacitively coupled to each other through alternating portions of the second conductive material between conductive vias associated with the first group of capacitors and conductive vias associated with the second group of capacitors. ### Claim 21 A method of forming a capacitor structure in a semiconductor device, the method comprising: forming a stack comprising alternating first dielectric materials and second dielectric materials; forming openings in the stack in a memory array region and in a via region of the semiconductor device; selectively removing portions of the second dielectric materials from the stack to form gaps between adjacent portions of the alternating first dielectric materials; forming a first conductive material in the gaps to form the stack to comprise alternating dielectric materials and first conductive materials; forming a dielectric material on a sidewall of the openings in the via region; forming a second conductive material in the openings of the via region over the dielectric material to form conductive vias comprising a portion of a capacitor structure comprising the second conductive material, the dielectric material on the sidewall of the conductive via, and the first conductive material; forming a first conductive line in electrical communication with a first group of the conductive vias; and forming a second conductive line in electrical communication with a second group of the conductive vias. ### Claim 22 (depends on 21) The method of claim 21, further comprising electrically coupling the first conductive line to a first component of the semiconductor device and electrically coupling the second conductive line to a second component of the semiconductor device to capacitively couple the first component to the second component. ### Claim 23 An electronic system, comprising: a processor; a semiconductor device operably coupled to the processor, the semiconductor device including a capacitor structure comprising: a first set of capacitors comprising a first group of conductive vias extending through a stack of conductive materials and dielectric materials; a second set of capacitors comprising a second group of conductive vias extending through the stack of conductive materials and dielectric materials, wherein each conductive via of the first group of conductive vias and the second group of conductive vias comprises a dielectric liner on a sidewall thereof and a conductive material filling the conductive via; a first electrically conductive lead in electrical communication with the first set of capacitors; and a second electrically conductive lead in electrical communication with the second set of capacitors; and a power supply in operable communication with the processor. ### Claim 24 A semiconductor device, comprising: a first component of an integrated circuit; a second component of the integrated circuit; and a capacitor structure between the first component of the integrated circuit and the second component of the integrated circuit, the capacitor structure comprising: conductive vias extending through alternating first dielectric materials and first conductive materials, each conductive via including a second dielectric material on a sidewall thereof and a central portion comprising a second conductive material; and capacitors each defined by a portion of the second conductive material, the second dielectric material, and one region of the first conductive material, wherein the conductive vias are arranged in rows and columns, wherein every other column is in electrical communication with a first conductive line and the other of the every other columns is in electrical communication with a second conductive line. ### Claim 25 A semiconductor device, comprising: a first component of an integrated circuit; a second component of the integrated circuit; a capacitor structure between the first component of the integrated circuit and the second component of the integrated circuit, the capacitor structure comprising: conductive vias extending through alternating first dielectric materials and first conductive materials, each conductive via including a second dielectric material on a sidewall thereof and a central portion comprising a second conductive material; and capacitors each defined by a portion of the second conductive material, the second dielectric material, and one region of the first conductive material; and a memory cell region including memory cell pillars extending through the alternating first dielectric materials and first conductive materials. ### Claim 26 A semiconductor device, comprising: a first component of an integrated circuit; a second component of the integrated circuit; and a capacitor structure between the first component of the integrated circuit and the second component of the integrated circuit, the capacitor structure comprising: conductive vias extending through alternating first dielectric materials and first conductive materials, each conductive via including a second dielectric material on a sidewall thereof and a central portion comprising a second conductive material, the second dielectric material having a thickness between about 10 nm and about 30 nm; and capacitors each defined by a portion of the second conductive material, the second dielectric material, and one region of the first conductive material.