# US 10,373,903 B2 · Laminate and making method

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- Number: US 10,373,903 B2
- Document ID: US10373903B2
- Status: Granted
- Kind: B2
- Application number: 15/928,301
- Filed: 2018-03-22
- Published: 2018-09-27
- Granted: 2019-08-06
- Earliest claimed: 2017-03-27
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Hiroyuki Yasuda; Michihiro Sugo; Hideto Kato; Kazunori Kondo
- Web page: https://patentgrep.com/patent/US10373903B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- C08G 8/04: of aldehydes
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09D 161/12: with polyhydric phenols
- H10P 72/70: for supporting or gripping
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- C23C 14/205: {by cathodic sputtering}
- C23C 14/34: Sputtering
- C25D 3/38: of copper
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/66: Conductive materials thereof
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

## Claims

### Claim 1

A laminate comprising a support, a resin layer formed on the support, a metal layer formed on the resin layer, an insulating layer and a redistribution layer formed on the metal layer, the resin layer comprising a photo-decomposable resin having light-shielding properties and having a transmittance of up to 20% with respect to light of wavelength 355 nm,
wherein the resin having light-shielding properties contains a fused ring in the main chain.

### Claim 2 (depends on 1)

The laminate of claim 1 wherein the metal layer comprises at least one metal selected from the group consisting of titanium, aluminum, copper, tungsten, tantalum, molybdenum, chromium, niobium, and gold.

### Claim 3 (depends on 2)

The laminate of claim 2 wherein the metal layer comprises at least one metal selected from the group consisting of titanium, aluminum, copper, and titanium-tungsten alloy.

### Claim 4 (depends on 1)

The laminate of claim 1 wherein the insulating layer comprises at least one resin selected from the group consisting of benzocyclobutene, epoxy resins, polyimide resins, silicone resins, and polybenzoxazole.

### Claim 5 (depends on 1)

The laminate of claim 1 wherein the resin layer is formed of a cured product of a resin composition (A) comprising a resin (A) comprising repeating units having the formula (1):
wherein R1 to R3 are each independently hydrogen, hydroxyl or a C1-C20 monovalent organic group, at least one of R1 to R3 being hydroxyl, and R4 is hydrogen or an optionally substituted C1-C30 monovalent organic group.

### Claim 6 (depends on 1)

A method for preparing the laminate of claim 1, comprising the steps of:
(a) forming the resin layer directly on the support,
(b) forming the metal layer on the resin layer,
(c) fainting the insulating layer on the metal layer and forming a pattern in the insulating layer,
(d) forming a conductive layer on the patterned insulating layer,
(e) forming a plating resist layer on the conductive layer and forming a pattern in the plating resist layer to expose the conductive layer between pattern features of the plating resist layer, and
(f) forming a redistribution layer on the exposed portion of the conductive layer between pattern features of the plating resist layer.