# US 10,373,897 B2 · Semiconductor devices with improved thermal and electrical performance

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- Number: US 10,373,897 B2
- Document ID: US10373897B2
- Status: Granted
- Kind: B2
- Application number: 15/376,756
- Filed: 2016-12-13
- Published: 2017-06-22
- Granted: 2019-08-06
- Earliest claimed: 2015-12-18
- Assignees: Infineon Technologies Austria AG
- Applicants: Infineon Technologies Austria AG
- Inventors: Ralf Otremba; Felix Grawert; Amirul Afiq Hud; Uwe Kirchner; Teck Sim Lee; Guenther Lohmann; Hwee Yin Low; Edward Fuergut; Bernd Schmoelzer; Fabian Schnoy; Franz Stueckler
- Web page: https://patentgrep.com/patent/US10373897B2

## CPC

- H10W 70/461: {specially adapted for cooling}
- H10W 40/10: Arrangements for heating
- H10W 40/778: {in encapsulations}
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/427: {Bent parts}
- H10W 70/429: {being the outer leads}
- H10W 70/435: {of insulating layers on leadframes, e.g. bridging members}
- H10W 70/465: {Bumps or wires}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/07552: {changes in structures or sizes}
- H10W 72/527: {Multiple bond wires having different sizes}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A device may include a carrier, a semiconductor chip arranged over a first surface of the carrier, and an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip. A second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsulation body. The device may further include electrical contact elements electrically coupled to the semiconductor chip and protruding out of the encapsulation body exclusively through two opposing side surfaces of the encapsulation body which have the smallest surface areas of all the side surfaces of the encapsulation body, and an electrically insulating layer arranged over the exposed second surface of the carrier.

## Claims

### Claim 1

A device, comprising:
a carrier;
a semiconductor chip arranged over a first surface of the carrier;
an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip, wherein a second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsulation body;
electrical contact elements electrically coupled to the semiconductor chip and protruding out of the encapsulation body exclusively through two opposing side surfaces of the encapsulation body which have the smallest surface areas of all the side surfaces of the encapsulation body;
a first material deposited over one or more of the electrical contact elements;
and a second material deposited over the exposed second surface of the carrier;
and wherein the first material is a solder-wettable material, and wherein the second material is a solder non-wettable material.

### Claim 2 (depends on 1)

The device of claim 1,
wherein the electrically insulating layer comprises at least one of a silicon dioxide, a fluorine-doped silicon dioxide, a carbon-doped silicon dioxide, a polymeric dielectric, a nitride, a metal oxide.

### Claim 3 (depends on 1)

The device of claim 1,
wherein the electrically insulating layer has a thickness in a range from 50 micrometer to 500 micrometer.

### Claim 4 (depends on 1)

The device of claim 1,
wherein the carrier comprises a diepad of a leadframe and the electrical contact elements comprise leads of the leadframe.

### Claim 5 (depends on 1)

The device of claim 1,
wherein the parts of the electrical contact elements protruding out of the encapsulation body are bent in a direction towards a mounting level of the device.

### Claim 6 (depends on 1)

The device of claim 1,
wherein the device is configured to be mounted on a contact surface using a surface mount technology or a through hole technology.

### Claim 7 (depends on 1)

The device of claim 1, wherein the first material has a melting temperature of less than 260 degrees Celsius.

### Claim 8 (depends on 7)

The device of claim 7, wherein the second material has a melting temperature of at least 260 degrees Celsius.