# US 10,373,896 B2 · Semiconductor module and drive device equipped with semiconductor module

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- Number: US 10,373,896 B2
- Document ID: US10373896B2
- Status: Granted
- Kind: B2
- Application number: 15/117,238
- Filed: 2014-03-28
- Published: 2016-12-01
- Granted: 2019-08-06
- Earliest claimed: 2014-03-28
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Shunsuke Fushie; Yu Kawano; Yoshihito Asao; Akihiko Mori
- Web page: https://patentgrep.com/patent/US10373896B2

## CPC

- H10W 70/461: {specially adapted for cooling}
- H10W 40/10: Arrangements for heating
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/435: {of insulating layers on leadframes, e.g. bridging members}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/465: {Bumps or wires}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/763: {between laterally-adjacent chips}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a semiconductor module having an integrated insulating sheet structure, wherein detachment of the insulating sheet can be suppressed and improved reliability of the semiconductor module is achieved, by adopting a structure in which at least one location of the insulating sheet is sunken inside a mold, and a sealing resin body and the insulating sheet of the semiconductor module form a protrusion.

## Claims

### Claim 1

A semiconductor module, comprising:
a lead frame which is formed of a plurality of terminals and on which electronic components are mounted;
an insulating sheet arranged in parallel with the lead frame on a rear surface side of the lead frame with respect to a surface where the electronic components are mounted; and
a resin sealing body which seals the lead frame, the electronic components and the insulating sheet,
wherein a peripheral portion of the insulating sheet on a rear surface side with respect to a surface in contact with the lead frame is covered by an inwardly extending portion of the resin sealing body, and a central portion of the insulating sheet corresponding to a portion other than the peripheral portion is exposed as a region that is not sealed by the resin sealing body,
at least one of said plurality of terminals is extended to the outside of the resin sealing body and have a surface above said insulating sheet and in substantially the same plane as a surface of said lead frame in contact with said insulating sheet,
a distance by which said inwardly extending portion extends inwardly beyond an edge of said insulating sheet is greater in a position underlying said at least one terminal than in other positions not underlying said at least one terminal; and
taking a resin width when the resin sealing body seals the peripheral portion to be t2, and for said at least one terminal extended to the outside of the resin body, taking a terminal width of the one terminal included inside the resin sealing body to be t3, the sealing by the resin sealing body is carried out in such a manner that at least one location satisfies the relationship:
t3>t2.

### Claim 2 (depends on 1)

The semiconductor module according to claim 1,
wherein the insulating sheet has a metal member corresponding to a metal foil or metal block on the rear surface side with respect to the surface in contact with the lead frame, the metal member being of a size equal to or smaller than the size of the insulating sheet and being arranged in parallel with the lead frame,
the resin sealing body seals the lead frame, the electronic components and the insulating sheet having the metal member, and
at least a portion of a peripheral portion of the insulating sheet on the rear surface side having the metal member is covered by said inwardly extending portion of the resin sealing body, and in said central portion of the insulating sheet, the metal member is exposed in said region that is not sealed by the resin sealing body.

### Claim 3 (depends on 2)

The semiconductor module according to claim 2, wherein, taking a resin height in said inwardly extending portion to be t1, the sealing by the resin sealing body is carried out so as to satisfy the relationship:
t2>t1.

### Claim 4 (depends on 2)

The semiconductor module according to claim 2, wherein the electronic components are arranged on the lead frame within a range corresponding to the portion exposed as the region that is not sealed by the resin sealing body.

### Claim 5 (depends on 1)

The semiconductor module according to claim 1, wherein, taking a resin height in said inwardly extending portion to be t1, the sealing by the resin sealing body is carried out so as to satisfy the relationship:
t2>t1.

### Claim 6 (depends on 1)

The semiconductor module according to claim 1, wherein the electronic components are arranged on the lead frame within a range corresponding to the portion exposed as the region that is not sealed by the resin sealing body.

### Claim 7 (depends on 1)

A drive device equipped with a semiconductor module, the drive device comprising:
the semiconductor module according to claim 1; and
a heat sink on which the semiconductor module is mounted, the heat sink being positioned so as to contact the region that is not sealed by the resin sealing body.

### Claim 8 (depends on 7)

The drive device equipped with a semiconductor module according to claim 7, further comprising a frame structure which presses the semiconductor module towards the heat sink from above the semiconductor module.

### Claim 9

A semiconductor module, comprising:
a lead frame which is formed of a plurality of terminals and on which electronic components are mounted;
an insulating sheet arranged in parallel with the lead frame on a rear surface side of the lead frame with respect to a surface where the electronic components are mounted; and
a resin sealing body which seals the lead frame, the electronic components and the insulating sheet,
wherein a peripheral portion of the insulating sheet on a rear surface side with respect to a surface in contact with the lead frame is covered by an inwardly extending portion of the resin sealing body, and a central portion of the insulating sheet corresponding to a portion other than the peripheral portion is exposed as a region that is not sealed by the resin sealing body,
at least one of said plurality of terminals is extended to the outside of the resin sealing body,
a distance by which said inwardly extending portion extends inwardly beyond an edge of said insulating sheet is greater in a position underlying said at least one terminal than in other positions not underlying said at least one terminal; and
taking a resin width when the resin sealing body seals the peripheral portion to be t2, and for said at least one of said terminals extended to the outside of the resin body, taking a terminal width of the one terminal included inside the resin sealing body to be t3, the sealing by the resin sealing body is carried out in such a manner that at least one location satisfies the relationship:
t3>t2.

### Claim 10

A semiconductor module, comprising:
a lead frame which is formed of a plurality of terminals and on which electronic components are mounted;
an insulating sheet arranged in parallel with the lead frame on a rear surface side of the lead frame with respect to a surface where the electronic components are mounted; and
a resin sealing body which seals the lead frame, the electronic components and the insulating sheet,
wherein a peripheral portion of the insulating sheet on a rear surface side with respect to a surface in contact with the lead frame is covered by an inwardly extending portion of the resin sealing body, and a central portion of the insulating sheet corresponding to a portion other than the peripheral portion is exposed as a region that is not sealed by the resin sealing body,
at last one of said plurality of terminals is extended to the outside of the resin sealing body,
a distance by which said inwardly extending portion extends inwardly beyond an edge of said insulating sheet is greater in a position underlying said at least one terminal than in other positions not underlying said at least one terminal;
wherein the insulating sheet has a metal member corresponding to a metal foil or metal block on the rear surface side with respect to the surface in contact with the lead frame, the metal member being of a size equal to or smaller than the size of the insulating sheet and being arranged in parallel with the lead frame,
the resin sealing body seals the lead frame, the electronic components and the insulating sheet having the metal member,
at least a portion of a peripheral portion of the insulating sheet on the rear surface side having the metal member is covered by said inwardly extending portion of the resin sealing body, and in said central portion of the insulating sheet, the metal member is exposed in said region that is not sealed by the resin sealing body; and
taking a resin width when the resin sealing body seals the peripheral portion to be t2, and for one of said terminals extended to the outside of the resin body, taking a terminal width of the one terminal included inside the resin sealing body to be t3, the sealing by the resin sealing body is carried out in such a manner that at least one location satisfies the relationship:
t3>t2.