# US 10,373,894 B2 · Package structure and the method to fabricate thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,894 B2 - Document ID: US10373894B2 - Status: Granted - Kind: B2 - Application number: 15/334,308 - Filed: 2016-10-26 - Published: 2017-02-16 - Granted: 2019-08-06 - Earliest claimed: 2012-02-22 - Assignees: Cyntec Co., Ltd. - Applicants: Cyntec Co., Ltd. - Inventors: Bau-Ru Lu; Jeng-Jen Li; Kun-Hong Shih; Kaipeng Chiang - Web page: https://patentgrep.com/patent/US10373894B2 ## CPC - H10W 70/442: {of multiple leadframes in a single chip} - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H10W 70/413: {Insulating or insulated substrates serving as die pads (H10W70/468 takes precedence)} - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/451: {Multilayered leadframes} - H10W 70/635: {Through-vias} - H10W 70/68: Shapes or dispositions thereof - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/811: {Multiple chips on leadframes} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified. ## Claims ### Claim 1 A package structure, comprising: a lead frame, formed by a plurality of sub lead frames each being made of metal, wherein each two adjacent sub lead frames are spaced apart by a vacancy, wherein said vacancy is filled with insulating material, wherein a recess is formed in a sub lead frame; a substrate, comprising conductive patterns therein; and a first electronic device, disposed on a bottom surface of the substrate and electrically connected to at least one portion of the conductive patterns of the substrate; wherein the substrate is disposed over the plurality of sub lead frames and said vacancy with at least one portion of the first conductive element disposed in the recess; and wherein the first electronic device is electrically connected to the lead frame via at least one portion of the conductive patterns of the substrate, and a plurality of pads are disposed on the bottom surface of the lead frame, wherein a first conductive pattern and a second conductive pattern of the substrate are respectively electrically connected to a first pad and a second pad via a corresponding sub lead frame. ### Claim 2 (depends on 1) The package structure according to claim 1, wherein the first conductive pattern of the substrate is mounted on a top surface of the lead frame to electrically connect with the lead frame, wherein the first conductive pattern comprises a first conductive pillar disposed in the substrate and extending from the top surface of the substrate to the bottom surface of the substrate. ### Claim 3 (depends on 2) The package structure according to claim 2, wherein the second conductive pattern of the substrate is mounted on the top surface of the lead frame to electrically connect with the lead frame. ### Claim 4 (depends on 3) The package structure according to claim 3, wherein the second conductive pattern comprises a second conductive pillar disposed in the substrate and extending from the top surface of the substrate to the bottom surface of the substrate. ### Claim 5 (depends on 1) The package structure according to claim 1, wherein a second electronic device, disposed on a top surface of the substrate and electrically connected to the conductive patterns of the substrate. ### Claim 6 (depends on 1) The package structure according to claim 1, wherein the substrate is a PCB or a ceramic substrate. ### Claim 7 (depends on 1) The package structure according to claim 1, wherein the substrate comprises a metallic plate, wherein the metallic plate is electrically coupled to one of the plurality of sub lead frames. ### Claim 8 (depends on 1) The package structure according to claim 1, further comprising: a second conductive element disposed on the top surface of the substrate and electrically connected to the conductive patterns of the substrate. ### Claim 9 (depends on 1) The package structure according to claim 1, further comprising: a vacancy in the substrate; and a second conductive element disposed in the vacancy of the substrate and electrically connected to the conductive patterns of the substrate. ### Claim 10 A package structure, comprising: a lead frame, formed by a plurality of metal parts each being made of metal, wherein each two adjacent metal parts are spaced apart by a vacancy, wherein said vacancy is filled with insulating material, wherein a recess is formed in a metal part; a substrate, comprising conductive patterns therein; and a first electronic device, disposed on a bottom surface of the substrate and electrically connected to at least one portion of the conductive patterns of the substrate; wherein the substrate is disposed over the plurality of metal parts and said vacancy with at least one portion of the first conductive element disposed in the recess; and wherein the first electronic device is electrically connected to the lead frame via at least one portion of the conductive patterns of the substrate, and a plurality of pads are disposed on the bottom surface of the lead frame, wherein a first conductive pattern and a second conductive pattern of the substrate are respectively electrically connected to a first pad and a second pad via a corresponding metal part. ### Claim 11 (depends on 10) The package structure according to claim 10, wherein the first conductive pattern of the substrate is mounted on a top surface of the lead frame to electrically connect with the lead frame, wherein the first conductive pattern comprises a first conductive pillar disposed in the substrate and extending from the top surface of the substrate to the bottom surface of the substrate. ### Claim 12 (depends on 11) The package structure according to claim 11, wherein the second conductive pattern of the substrate is mounted on the top surface of the lead frame to electrically connect with the lead frame. ### Claim 13 (depends on 12) The package structure according to claim 12, wherein the second conductive pattern comprises a second conductive pillar disposed in the substrate and extending from the top surface of the substrate to the bottom surface of the substrate. ### Claim 14 (depends on 10) The package structure according to claim 10, wherein the substrate is a PCB or a ceramic substrate. ### Claim 15 (depends on 10) The package structure according to claim 10, wherein the substrate comprises a metallic plate, wherein the metallic plate is electrically coupled to one of the plurality of metal parts. ### Claim 16 (depends on 10) The package structure according to claim 10, further comprising: a second conductive element disposed on the top surface of the substrate and electrically connected to the conductive patterns of the substrate. ### Claim 17 (depends on 10) The package structure according to claim 10, further comprising: a vacancy in the substrate; and a second conductive element disposed in the vacancy of the substrate and electrically connected to the conductive patterns of the substrate. ### Claim 18 (depends on 10) The package structure according to claim 10, wherein a second electronic device, disposed on a top surface of the substrate and electrically connected to the conductive patterns of the substrate.