# US 10,373,892 B2 · High current high power solid state relay

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- Number: US 10,373,892 B2
- Document ID: US10373892B2
- Status: Granted
- Kind: B2
- Application number: 15/549,608
- Filed: 2015-02-18
- Published: 2018-02-01
- Granted: 2019-08-06
- Earliest claimed: 2015-02-18
- Assignees: Te Connectivity Corporation; Te Connectivty India Private Limited
- Applicants: Te Connectivity Corporation; Te Connectivity India Private Limited
- Inventors: Palanisamy Vellaiyanaicken; Robert Steve Felisida Delacruz
- Web page: https://patentgrep.com/patent/US10373892B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H03K 17/08104: {in field-effect transistor switches (H03K17/0812, H03K17/0814 take precedence)}
- H03K 17/122: {in field-effect transistor switches}
- H10W 72/00: Interconnections or connectors in packages
- H10W 90/00: Package configurations
- H02M 1/08: Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M 3/33523: {with galvanic isolation between input and output of both the power stage and the feedback loop}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)

## Abstract

A solid state relay includes a source bus and a drain bus. Solid state switches are arranged to switch power from the drain bus to the source bus. A control circuit controls a gate of the solid state switches. Each solid state switch includes a source terminal, a drain terminal and a gate terminal. The source terminals are conductively attached to the source bus and the drain terminals are conductively attached to the drain bus. The gate terminal opens and closes power through the solid state switches. The source bus is electrically isolated from the drain bus when the plurality of solid state switches is controlled by the gate terminal to an open state, the source bus is in electrical communication with the drain bus when the solid state switches is controlled by the gate terminal to a closed state.

## Claims

### Claim 1

A solid state relay comprising:
a source bus and a drain bus; a plurality of solid state switches arranged to switch power from the drain bus to the source bus; and a control circuit for controlling a gate terminal of the plurality of solid state switches;
each solid state switch of the plurality of solid state switches comprising a source terminal, a drain terminal and a gate terminal, the plurality of solid state switches arranged in two rows;
wherein the source terminals are conductively attached to the source bus and the drain terminals are conductively attached to the drain bus; and the gate bus in electrical communication with the control circuit;
the drain bus having a pair of side bus drain members including a left drain bus member and a right drain bus member, the side bus drain members extend parallel to left and right sides of source bus and are coplanar with the source bus, the side bus drain members connected with a drain bus connector member by a crossover member;
the source bus and the drain bus are positioned in a single layer;
the gate terminal operable to open and close a power flow through the plurality of solid state switches in response to a signal from the control circuit;
the source bus electrically isolated from the drain bus when the plurality of solid state switches is controlled by the gate terminal to an open state;
the source bus in electrical communication with the drain bus when the plurality of solid state switches is controlled by the gate terminal to a closed state.

### Claim 2 (depends on 1)

The solid state relay of claim 1, wherein the drain bus is connected to an electrical power source and configured to supply electrical current to an input of the plurality of solid state switches.

### Claim 3 (depends on 1)

The solid state relay of claim 1, wherein the source bus is connected at the output of the plurality of solid state switches and to a load to supply electrical current from the plurality of solid state switches.

### Claim 4 (depends on 1)

The solid state relay of claim 1, wherein each solid state switch of the plurality of solid state switches comprises a MOSFET.

### Claim 5 (depends on 1)

The solid state relay of claim 1, each of the side bus drain members connected to the source bus by an equal number of the plurality of solid state switches; the solid state switches fixedly attached to the respective source bus and side bus drain member.

### Claim 6 (depends on 5)

The solid state relay of claim 5, wherein the drain bus connector member configured to connect the drain bus to an external conductor connected to an electrical supply source.

### Claim 7 (depends on 6)

The solid state relay of claim 6, wherein the side bus drain members of the drain bus and the source bus are electrically isolated via an air gap, the air gap maintained by attachment of the solid state switches connected between the source bus and the pair of side bus drain members.

### Claim 8 (depends on 1)

The solid state relay of claim 1, wherein the plurality of solid state switches adjacent the source and the drain bus being configured in the single layer, the plurality of solid state switches, the source and the drain bus exposed directly to a heat dissipation surface of a solid state relay package for heat dissipation and increased current carrying capacity.

### Claim 9 (depends on 1)

The solid state relay of claim 1, further comprising a plurality of fins traversing an exterior surface of the solid state relay, the plurality of fins adapted to dissipate heat from the solid state relay.

### Claim 10

A solid state relay (SSR) package comprising: a cover portion and a bottom case portion defining a hollow interior for receiving a solid state relay; the cover portion and the bottom case portion in thermal conductive contact with the solid state relay and configured to dissipate heat generated in an operation of the solid state relay; the solid state relay comprising: a source bus and a drain bus; a plurality of solid state switches arranged to switch power to the source bus from the drain bus; and a control circuit for controlling a gate terminal of the plurality of solid state switches; each solid state switch of the plurality of solid state switches comprising a source terminal, a drain terminal and a gate terminal, the plurality of solid state switches arranged in two rows; wherein all of the source terminals are conductively attached to the source bus and all of the drain terminals conductively attached to the drain bus; and the gate bus in electrical communication with the control circuit; the drain bus having a pair of side bus drain members including a left drain bus member and a right drain bus member, the side bus drain members extend parallel to left and right sides of source bus and are coplanar with the source bus, the side bus drain members connected with a drain bus connector member by a crossover member; the source bus and the drain bus are positioned in a single layer; the gate terminal operable to open and close a power flow through the plurality of solid state switches in response to a signal from the control circuit; and the source bus electrically isolated from the drain bus when the plurality of solid state switches is controlled by the gate terminal to an open state; the source bus in electrical communication with the drain bus when the plurality of solid state switches is controlled by the gate terminal to a closed state.

### Claim 11 (depends on 10)

The SSR package of claim 10, wherein the control circuit comprises a controller board attached to one side of the case portion.

### Claim 12 (depends on 10)

The SSR package of claim 10, wherein the drain bus is connected at the input of the plurality of solid state switches and to an electrical supply source.

### Claim 13 (depends on 10)

The SSR package of claim 10, wherein each solid state switch of the plurality of solid state switches comprises a MOSFET.

### Claim 14 (depends on 10)

The SSR package of claim 10, wherein each of the side bus drain members connected to the source bus by a half of the plurality of solid state switches; the solid state switches fixedly attached to the respective source bus and side bus drain member.

### Claim 15 (depends on 10)

The SSR package of claim 10, wherein the drain bus connector member configured to connect the drain bus to an external conductor connected to an electrical supply source.

### Claim 16 (depends on 10)

The SSR package of claim 10, wherein the side bus drain members of the drain bus and the source bus are electrically isolated via an air gap, the air gap maintained by attachment of the solid state switches connected between the source bus and the pair of side bus members.

### Claim 17 (depends on 10)

The SSR package of claim 10, wherein the plurality of solid state switches adjacent the source and the drain bus being configured in the single layer, the plurality of solid state switches, the source and the drain bus exposed directly to a heat dissipation surface of the SSR package for heat dissipation and increased current carrying capacity.

### Claim 18 (depends on 10)

The SSR package of claim 10, wherein the case bottom comprises a plurality of fins traversing an exterior surface of the case bottom, the plurality of configured to dissipate heat from SSR package.