# US 10,373,890 B1 · Cooling techniques for semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,890 B1 - Document ID: US10373890B1 - Status: Granted - Kind: B1 - Application number: 15/948,747 - Filed: 2018-04-09 - Granted: 2019-08-06 - Earliest claimed: 2018-04-09 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Juergen Hoegerl; Andreas Grassmann - Web page: https://patentgrep.com/patent/US10373890B1 ## CPC - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H05K 7/20927: {Liquid coolant without phase change} - H10W 40/251: {Organics} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 70/465: {Bumps or wires} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H02M 1/08: Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H05K 7/2089: {for power electronics, e.g. for inverters for controlling motor} - H10W 72/07354: {changes in dispositions} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 72/381: {Auxiliary members} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 76/153: having interconnections in passages through the insulating or insulated base - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract In some examples, a device includes a high-side switch, a first high-side conductive element electrically connected to a first load terminal of the high-side switch, and a second high-side conductive element electrically connected to a second load terminal of the high-side switch. The device also includes a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element. The device further includes a low-side switch, a first low-side conductive element electrically connected to a first load terminal of the low-side switch, and a second low-side conductive element electrically connected to a second load terminal of the low-side switch. The layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element. ## Claims ### Claim 1 A device comprising: a high-side switch; a first high-side conductive element electrically connected to a first load terminal of the high-side switch; a second high-side conductive element electrically connected to a second load terminal of the high-side switch; a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element; a low-side switch; a first low-side conductive element electrically connected to a first load terminal of the low-side switch; a second low-side conductive element electrically connected to a second load terminal of the low-side switch, wherein the layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element; a printed circuit board (PCB) including an electrical interface and configured to: deliver control signals to the high-side switch based on signals received at the electrical interface; and deliver control signals to the low-side switch based on signals received at the electrical interface; a first body including the cooling material, the high-side switch, the first high-side conductive element, the second high-side conductive element, the low-side switch, the first low-side conductive element, and the second low-side conductive element; and a second body surrounding the first body, the second body including the PCB and interconnect elements configured to receive a high-side power supply, receive a low-side power supply, and deliver an output signal, wherein the electrical interface is at least partially exposed on the second body. ### Claim 2 (depends on 1) The device of claim 1, wherein the first high-side conductive element is positioned on a side of the high-side switch facing the low-side switch, wherein the first low-side conductive element is positioned on a side of the low-side switch facing the high-side switch, wherein the first high-side conductive element is electrically connected to a high-side power supply, wherein the first low-side conductive element is electrically connected to a low-side power supply, and wherein the second high-side conductive element is electrically connected to the second low-side conductive element to form a C-shaped interconnect element. ### Claim 3 (depends on 1) The device of claim 1, wherein the cooling material includes thermoplastic material. ### Claim 4 (depends on 1) The device of claim 1, wherein the first high-side conductive element is positioned on a side of the high-side switch facing the low-side switch, wherein the first low-side conductive element is positioned on a side of the low-side switch facing the high-side switch, and wherein the layer of cooling material separates the first low-side conductive element and the first high-side conductive element by a distance of less than one millimeter. ### Claim 5 (depends on 1) The device of claim 1, wherein the first high-side conductive element is positioned on a side of the high-side switch facing the low-side switch, wherein the first low-side conductive element is positioned on a side of the low-side switch facing the high-side switch, and wherein the first high-side conductive element is electrically connected to the first low-side conductive element to form a C-shaped interconnect element. ### Claim 6 A device comprising: a middle cooling element; a high-side cooling element; a high-side switch; an outside high-side conductive element positioned between the high-side switch and the high-side cooling element, wherein the outside high-side conductive element is electrically connected to a high-side power supply; a middle high-side conductive element electrically connected to a load terminal of the high-side switch, wherein the middle high-side conductive element is positioned between the high-side switch and the middle cooling element; a low-side cooling element; a low-side switch; an outside low-side conductive element positioned between the low-side switch and the low-side cooling element, wherein the outside low-side conductive element is electrically connected to a low-side power supply; and a middle low-side conductive element electrically connected to a load terminal of the low-side switch, wherein the middle low-side conductive element is positioned between the low-side switch and the middle cooling element, and wherein the middle high-side conductive element is electrically connected to the middle low-side conductive element to form a C-shaped interconnect element. ### Claim 7 (depends on 6) The device of claim 6, wherein the high-side switch, the low-side switch, and the C-shaped interconnect element comprise a first phase segment, the device further comprising a second phase segment comprising: a second high-side switch; a second low-side switch; and a second C-shaped interconnect element including: a second middle high-side conductive element electrically connected to a first load terminal of the second high-side switch and positioned between the second high-side switch and the middle cooling element; and a second middle low-side conductive element electrically connected to a first load terminal of the second low-side switch and positioned between the second low-side switch and the middle cooling element, wherein the outside high-side conductive element is electrically connected to a second load terminal of the second high-side switch and positioned between the second high-side switch and the high-side cooling element, and wherein the outside low-side conductive element is electrically connected to a second load terminal of the second low-side switch and positioned between the second low-side switch and the low-side cooling element. ### Claim 8 (depends on 6) The device of claim 6, further comprising a thermosetting polymer material, wherein the high-side switch is encapsulated in the thermosetting polymer material, and wherein the low-side switch is encapsulated in the thermosetting polymer material. ### Claim 9 (depends on 6) The device of claim 6, further comprising a thermoplastic material, wherein the thermoplastic material encapsulates the middle cooling element, the middle high-side conductive element, and the middle low-side conductive element, and wherein the thermoplastic material at least partially encapsulates the device. ### Claim 10 (depends on 9) The device of claim 9, wherein the middle cooling element is separated from the middle high-side conductive element by the thermoplastic material such that the middle cooling element is not in direct contact with the middle high-side conductive element, and wherein the middle cooling element is separated from the middle low-side conductive element by the thermoplastic material such that the middle cooling element is not in direct contact with the middle low-side conductive element. ### Claim 11 (depends on 10) The device of claim 10, wherein a distance through the thermoplastic material between the middle cooling element and the middle high-side conductive element is in a range from two hundred micrometers to one millimeter, and wherein a distance through the thermoplastic material between the middle cooling element and the middle low-side conductive element is in a range from two hundred micrometers to one millimeter. ### Claim 12 (depends on 9) The device of claim 9, further comprising a printed circuit board (PCB) including an electrical interface, wherein the PCB is configured to: deliver control signals to the high-side switch; and deliver control signals to the low-side switch, and wherein the thermoplastic material partially encapsulates the PCB such that the thermoplastic material does not cover the electrical interface. ### Claim 13 (depends on 6) The device of claim 6, further comprising a first fluid interface and a second fluid interface, wherein the middle cooling element is configured to carry fluid from the first fluid interface through the device to the second fluid interface. ### Claim 14 A method comprising: electrically connecting a first high-side conductive element to a first load terminal of a high-side switch; electrically connecting a second high-side conductive element to a second load terminal of a high-side switch; electrically connecting a first low-side conductive element to a first load terminal of a low-side switch; electrically connecting a second low-side conductive element to a second load terminal of a low-side switch; encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element in a layer of cooling material; encapsulating the low-side switch, the first low-side conductive element, and the first high-side conductive element in the layer of cooling material; positioning a cooling element such that the first high-side conductive element is positioned between the high-side switch and the cooling element and such that the first low-side conductive element is positioned between the low-side switch and the cooling element, wherein positioning the cooling element comprises positioning the cooling element such that the cooling element is not in direct contact with the first high-side conductive element and such that cooling element is not in direct contact with the first low-side conductive element; and encapsulating the cooling element in the layer of cooling material. ### Claim 15 A device comprising: a middle cooling element; a high-side cooling element; a high-side switch; an outside high-side conductive element positioned between the high-side switch and the high-side cooling element; a middle high-side conductive element electrically connected to a high-side power supply and to a load terminal of the high-side switch, wherein the middle high-side conductive element is positioned between the high-side switch and the middle cooling element; a low-side cooling element; a low-side switch; an outside low-side conductive element positioned between the low-side switch and the low-side cooling element; and a middle low-side conductive element electrically connected to a low-side power supply and to a load terminal of the low-side switch, wherein the middle low-side conductive element is positioned between the low-side switch and the middle cooling element, and wherein the outside high-side conductive element is electrically connected to the outside low-side conductive element to form a C-shaped interconnect element. ### Claim 16 (depends on 15) The device of claim 15, wherein the high-side switch, the low-side switch, and the C-shaped interconnect element comprise a first phase segment, the device further comprising a second phase segment comprising: a second high-side switch; a second low-side switch; and a second C-shaped interconnect element including: a second outside high-side conductive element electrically connected to a first load terminal of the second high-side switch and positioned between the second high-side switch and the high-side cooling element; and a second outside low-side conductive element electrically connected to a first load terminal of the second low-side switch and positioned between the second low-side switch and the low-side cooling element, wherein the middle high-side conductive element is electrically connected to a second load terminal of the second high-side switch and positioned between the second high-side switch and the middle cooling element, and wherein the middle low-side conductive element is electrically connected to a second load terminal of the second low-side switch and positioned between the second low-side switch and the middle cooling element. ### Claim 17 (depends on 15) The device of claim 15, further comprising a thermoplastic material at least partially encapsulating the device, wherein the thermoplastic material encapsulates the middle cooling element, the middle high-side conductive element, and the middle low-side conductive element, wherein the middle cooling element is separated from the middle high-side conductive element by the thermoplastic material such that the middle cooling element is not in direct contact with the middle high-side conductive element, and wherein the middle cooling element is separated from the middle low-side conductive element by the thermoplastic material such that the middle cooling element is not in direct contact with the middle low-side conductive element. ### Claim 18 (depends on 15) The device of claim 15, further comprising: a printed circuit board (PCB) including an electrical interface and configured to deliver control signals to the high-side switch and to the low-side switch; and a thermoplastic material partially encapsulating the PCB such that the thermoplastic material does not cover the electrical interface, wherein the thermoplastic material encapsulates the middle cooling element, the middle high-side conductive element, and the middle low-side conductive element. ### Claim 19 A device comprising: a cooling element; a high-side switch; a high-side conductive element electrically connected to a load terminal of the high-side switch, wherein the high-side conductive element is positioned between the high-side switch and the cooling element; a low-side switch; a low-side conductive element electrically connected to a load terminal of the low-side switch, wherein the low-side conductive element is positioned between the low-side switch and the cooling element; and a thermoplastic material encapsulating the cooling element, the high-side conductive element, and the low-side conductive element, wherein the cooling element is separated from the high-side conductive element by the thermoplastic material such that the cooling element is not in direct contact with the high-side conductive element, wherein the cooling element is separated from the low-side conductive element by the thermoplastic material such that the cooling element is not in direct contact with the low-side conductive element, and wherein the thermoplastic material at least partially encapsulates the device. ### Claim 20 A device comprising: a cooling element; a high-side switch; a high-side conductive element electrically connected to a load terminal of the high-side switch, wherein the high-side conductive element is positioned between the high-side switch and the cooling element; a low-side switch; a low-side conductive element electrically connected to a load terminal of the low-side switch, wherein the low-side conductive element is positioned between the low-side switch and the cooling element; a printed circuit board (PCB) including an electrical interface and configured to: deliver control signals to the high-side switch; and deliver control signals to the low-side switch; and a thermoplastic material encapsulating the cooling element, the high-side conductive element, and the low-side conductive element, wherein the thermoplastic material partially encapsulates the PCB such that the thermoplastic material does not cover the electrical interface, and wherein the thermoplastic material at least partially encapsulates the device.