# US 10,373,886 B2 · Preformed lead frame and lead frame packaged structure including the same

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- Number: US 10,373,886 B2
- Document ID: US10373886B2
- Status: Granted
- Kind: B2
- Application number: 15/591,552
- Filed: 2017-05-10
- Published: 2018-07-26
- Granted: 2019-08-06
- Earliest claimed: 2017-01-24
- Assignees: Chang Wah Technology Co., Ltd.
- Applicants: Chang Wah Technology Co., Ltd.
- Inventors: Chia-Neng Huang
- Web page: https://patentgrep.com/patent/US10373886B2

## CPC

- H10W 74/114: {by a substrate and the encapsulations}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/457: {of metallic layers on leadframes}
- H10W 74/014: {using batch processing}
- H10W 72/0198: {batch processes}
- H10W 72/07507: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A preformed lead frame includes a metallic substrate, a plurality of spaced-apart conductive lead frame units and intersecting trenches, a molding layer, and a plurality of conductive pads. The lead frame units and the molding layer are formed on the substrate. Each of the lead frame units includes a die supporting portion, a plurality of lead portions surrounding and spaced apart from the die supporting portion, and a gap formed among the die supporting portion and the lead portions. The trenches are formed among the conductive lead frame units. The molding layer fills the gaps and the trenches. Each of the conductive pads is formed on a top surface of the die supporting portion of a respective one of the lead frame units.

## Claims

### Claim 1

A preformed lead frame, comprising:
a metallic substrate;
a plurality of spaced-apart conductive lead frame units formed on said substrate, each of said lead frame units including at least one die supporting portion having a top surface opposite to said substrate, a plurality of spaced-apart lead portions surrounding and spaced apart from said at least one die supporting portion, and a gap formed among said at least one die supporting portion and said lead portions;
a plurality of intersecting trenches formed among said conductive lead frame units to isolate said conductive lead frame units from each other;
a molding layer formed on said substrate and filling said gaps of said lead frame units and said trenches; and
a plurality of conductive pads each formed on said top surface of said at least one die supporting portion of a respective one of said lead frame units,
wherein each of said lead portions of each of said lead frame units has a top surface opposite to said substrate, said molding layer having a top surface that is opposite to said substrate and that is flush with said top surface of said at least one die supporting portion of each of said lead frame units and said top surfaces of said lead portions of each of said lead frame units such that said top surface of said at least one die supporting portion of each of said lead frame units and said top surfaces of said lead portions of each of said lead frame units are exposed from said molding layer.

### Claim 2 (depends on 1)

The preformed lead frame of claim 1, wherein said at least one die supporting portion of each of said lead frame units includes a plurality of said spaced-apart die supporting portions, said conductive pads being respectively formed on said die supporting portions of said lead frame units.

### Claim 3 (depends on 1)

The preformed lead frame of claim 1, wherein said at least one die supporting portion and said lead portions of each of said lead frame units respectively have a layered structure.

### Claim 4 (depends on 1)

A lead frame packaged structure, comprising:
the preformed lead frame as claimed in claim 1;
a plurality of chips, each of which is adhered to a respective one of said conductive pads;
a plurality of wire sets, each of which electrically interconnects a respective one of said chips with said lead portions of a corresponding one of said lead frame units; and
a polymeric encapsulant encapsulating said preformed lead frame, said chips and said wire sets.

### Claim 5 (depends on 4)

The lead frame packaged structure of claim 4, wherein each of said lead portions of each of said lead frame units has said top surface and a bottom surface, said molding layer having said top surface and a bottom surface, said top surface of said molding layer being flush with said top surface of said at least one die supporting portion of each of said lead frame units and said top surfaces of said lead portions of each of said lead frame units, said bottom surface of said molding layer being flush with said bottom surface of said at least one die supporting portion of each of said lead frame units and said bottom surfaces of said lead portions of each of said lead frame units.

### Claim 6 (depends on 4)

The lead frame packaged structure of claim 4, wherein said at least one die supporting portion of each of said lead frame units includes a plurality of said spaced-apart die supporting portions, said conductive pads being respectively formed on said die supporting portions of said lead frame units.

### Claim 7 (depends on 4)

The lead frame packaged structure of claim 4, wherein said at least one die supporting portion and said lead portions of each of said conductive lead frame units respectively have a layered structure.