# US 10,373,863 B2 · Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,863 B2 - Document ID: US10373863B2 - Status: Granted - Kind: B2 - Application number: 15/468,911 - Filed: 2017-03-24 - Published: 2017-07-13 - Granted: 2019-08-06 - Earliest claimed: 2014-09-30 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Yuichiro Goto; Tadashi Oomatsu - Web page: https://patentgrep.com/patent/US10373863B2 ## CPC - H10W 20/091: {by printing or stamping} - B29C 37/0053: {Moulding articles characterised by the shape of the surface, e.g. ribs, high polish (mould construction therefor B29C33/42; surface shaping of articles B29C59/00; by incorporating filler in or near the surface B29C70/64)} - B29C 44/02: for articles of definite length, i.e. discrete articles - B29C 44/12: Incorporating or moulding on preformed parts, e.g. inserts or reinforcements - H10P 14/40: of conductive or resistive materials - H10P 14/665: {Porous materials} - H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC} - H10P 50/28: of insulating materials - H10P 76/00: Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography - H10W 20/01: {Manufacture or treatment} - H10W 20/056: {by filling conductive material into holes, grooves or trenches} - H10W 20/072: {of dielectric parts comprising air gaps} - H10W 20/084: {for dual-damascene structures} - H10W 20/42: Vias, e.g. via plugs - H10W 20/435: {Cross-sectional shapes or dispositions of interconnections} - H10W 20/4421: {the principal metal being copper} - H10W 20/46: comprising air gaps - H10W 20/48: Insulating materials thereof - B29C 44/1219: {Foaming between a movable mould part and the preformed part} - B29K 2033/12: {Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate} - B29K 2105/0002: {monomers or prepolymers} - B29K 2105/0094: {having particular viscosity} - B29K 2105/041: {Microporous} - B29K 2105/045: {with open cells} - B29K 2909/02: Ceramics - B29K 2995/0006: Dielectric - B29L 2031/3406: {Components, e.g. resistors} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract Provided are a method of manufacturing a porous body capable of easily manufacturing a porous body, a porous body, a method of manufacturing a device, a device, a method of manufacturing a wiring structure, and a wiring structure. A photocurable composition including a condensing gas and a polymerizable compound is applied to a substrate or a mold, the photocurable composition is sandwiched between the substrate and the mold and then the photocurable composition is irradiated with light to cure the photocurable composition, and the mold is released from a surface of the cured photocurable composition. ## Claims ### Claim 1 A method of manufacturing a porous body comprising: applying a photocurable composition including a condensing gas and a polymerizable compound to a substrate or a mold; sandwiching the photocurable composition between the substrate and the mold and then irradiating the photocurable composition with light to cure the photocurable composition; and releasing the mold from a surface of the cured photocurable composition; wherein the method further comprises, before the applying, leaving the photocurable composition to stand for a predetermined period of time in a closed space in which the condensing gas is present; the condensing gas is a gas having a pressure of 0.05 to 1 MPa for achieving gas-liquid equilibrium at 25° C.; the polymerizable compound has a ΔSP, which is represented by the following Equation (1), of 15 (J/cm3)1/2 or less: ΔSP=|solubility parameter (SP) value of polymerizable compound−SP value of condensing gas included in photocurable composition|. . . (1); a second condensing gas is introduced between the mold and the substrate at the sandwiching; and the second condensing gas is different from the condensing gas dissolved in the photocurable composition. ### Claim 2 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein the polymerizable compound having a ΔSP, which is represented by the following Equation (1), of 15 (J/cm3)1/2 or less is 50 to 100% by mass with respect to a total polymerizable compound included in the photocurable composition. ### Claim 3 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein the condensing gas is dissolved to be saturated in the photocurable composition. ### Claim 4 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein the mold has a pattern. ### Claim 5 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein the mold has a pattern having a line width of 50 nm or less. ### Claim 6 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein the mold has a multistage roughness pattern. ### Claim 7 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein in an atmosphere of the presence of one or more gases selected from a condensing gas and a helium gas, the photocurable composition applied to the substrate or the mold is sandwiched between the substrate and the mold. ### Claim 8 (depends on 1) A method of manufacturing a device comprising: the method of manufacturing a porous body according to claim 1. ### Claim 9 (depends on 1) A method of manufacturing a wiring structure comprising: the method of manufacturing a porous body according to claim 1. ### Claim 10 (depends on 1) The method of manufacturing a porous body according to claim 1, wherein a specific dielectric constant at 25° C. of the porous body is 3.4 or less.