# US 10,373,848 B2 · Method of preparing the LED display device

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- Number: US 10,373,848 B2
- Document ID: US10373848B2
- Status: Granted
- Kind: B2
- Application number: 15/965,976
- Filed: 2018-04-30
- Published: 2018-08-30
- Granted: 2019-08-06
- Earliest claimed: 2017-05-05
- Assignees: Shenzhen Hoxled Optoelectronic Technology Co., Ltd.
- Applicants: Shenzhen HOXLED Optoelectronic Technology Co., Ltd.
- Inventors: Jun Deng; Youfa Zhou
- Web page: https://patentgrep.com/patent/US10373848B2

## CPC

- H10P 72/0441: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like}
- B29C 45/14065: {Positioning or centering articles in the mould}
- B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components}
- B29C 45/57: Exerting after-pressure on the moulding material {(B29C45/174 takes precedence)}
- H10H 20/852: Encapsulations
- H10H 20/853: characterised by their shape
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 90/00: Package configurations
- B29K 2063/00: Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material
- B29L 2031/3475: {Displays, monitors, TV-sets, computer screens}
- H10H 20/0362: {of encapsulations}
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.

## Claims

### Claim 1

A method of preparing the LED display device, comprising:
step a, providing a plate jig and a substrate having LED encapsulation units, laying a release paper on the plate jig, and the size of the plate jig and the release paper is larger than that of the substrate;
step b, placing a mold jig on the release paper making the mold jig and the release paper on the bottom form a receiving cavity; the mold jig has a frame structure whose size is smaller than that of the plate jig and larger than that of the substrate, and the thickness of the mold jig is larger than the height of the LED encapsulation unit disposed on the substrate;
step c, injecting liquid epoxy resin in the receiving cavity, then vacuumizing;
step d, removing the vacuum state after a side of the substrate on which the LED encapsulation unit is disposed is pressed into the receiving cavity; and
step e, after the liquid epoxy resin is cured to form a protection layer, peeling off the plate jig, the release paper and the mold jig, and trimming the protection layer.

### Claim 2 (depends on 1)

The method of preparing the LED display device according to claim 1, before the step c, further comprising placing the plate jig, the release paper, the mold jig, and the liquid epoxy resin in the receiving cavity, then vacuumizing the receiving cavity until the vacuum degree in the receiving cavity reaches 0.098 Mpa˜0.1 Mpa.

### Claim 3 (depends on 1)

The method of preparing the LED display device according to claim 1, between the steps a and b, further comprising placing a surface treatment jig on the release paper, and the size of the surface treatment jig is larger than that of the mold jig.

### Claim 4 (depends on 1)

The method of preparing the LED display device according to claim 1, between the steps d and e, further comprising providing a limited block on a upper side of the substrate away from the LED encapsulation unit for limiting the substrate.