# US 10,373,805 B2 · Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal

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- Number: US 10,373,805 B2
- Document ID: US10373805B2
- Status: Granted
- Kind: B2
- Application number: 16/038,076
- Filed: 2018-07-17
- Published: 2018-11-08
- Granted: 2019-08-06
- Earliest claimed: 2015-12-10
- Assignees: Lam Research Corporation
- Applicants: Lam Research Corporation
- Inventors: Hyungjoon Kim; Sunil Kapoor; Karl Leeser; Vince Burkhart
- Web page: https://patentgrep.com/patent/US10373805B2

## CPC

- H01J 37/32082: {Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence)}
- C23C 16/505: using radio frequency discharges
- H01J 37/32009: {Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources (plasma generation in general H05H1/24)}
- H01J 37/32091: {the radio frequency energy being capacitively coupled to the plasma}
- H01J 37/32174: {Circuits specially adapted for controlling the RF discharge}
- H01J 37/3244: {Gas supply means}
- H01J 37/32577: {Electrical connecting means}
- H01J 37/32697: {Electrostatic control}
- H01J 37/32706: {Polarising the substrate}
- H01J 37/32715: {Workpiece holder}
- H10P 72/72: using electrostatic chucks
- H01J 2237/332: Coating
- H01J 2237/334: Etching
- H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel}
- H10P 72/7621: {characterised by supporting two or more semiconductor substrates}
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power. The isolation system further includes a plurality of channel paths connected to the input junction for distributing the RF power among the channel paths. The isolation system includes an output junction connected between each of the channel paths and to an electrode of a plasma chamber for receiving portions of the distributed RF power to output combined power and providing the combined RF power to the electrode. Each of the channel paths includes bottom and top capacitors for blocking a signal of the different type than that of the RF power. The isolation system avoids a risk of electrical arcing created by a voltage difference between an RF terminal and a non-RF terminal when the terminals are placed proximate to each other.

## Claims

### Claim 1

An isolation system comprising:
a first circuit having a first plurality of filter elements, wherein the first circuit is configured to be coupled to a substrate support of a plasma chamber;
a second circuit having a second plurality of filter elements, wherein the second circuit is configured to be coupled to a radio frequency (RF) power source and an alternating current (AC) power source, wherein the first and second circuits are configured to provide isolation between the RF power source and the AC power source;
a slip ring coupled between the first circuit and the second circuit, wherein the slip ring provides an electrical interface configured to communicate both RF power from the RF power source and AC power from the AC power source,
wherein the first circuit and the substrate support are configured to rotate and the electrical interface of the slip ring is configured to rotate to enable the second circuit to remain fixed and connected to the RF power source and the AC power source.

### Claim 2 (depends on 1)

The isolation system of claim 1, wherein the first plurality of filter elements include a first capacitor and a second capacitor, wherein the first capacitor is coupled to the second capacitor and both the first and second capacitors are configured to be coupled to a lower electrode of the substrate support.

### Claim 3 (depends on 2)

The isolation system of claim 2, wherein the second plurality of filter elements include a third capacitor and a fourth capacitor, wherein the third capacitor is coupled to the fourth capacitor and both the third and fourth capacitors are configured to be coupled to the RF power source and the AC power source.

### Claim 4 (depends on 1)

The isolation system of claim 1, wherein the first circuit includes a plurality of capacitors to filter out the AC power received from the AC power source via the slip ring to prevent the AC power from being supplied to a lower electrode of the substrate support to provide the isolation between the RF power source and the AC power source, wherein the plurality of capacitors of the first circuit are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the AC power source.

### Claim 5 (depends on 4)

The isolation system of claim 4, wherein the second circuit includes a plurality of capacitors to filter out the AC power received from the AC power source to prevent the AC power from being supplied to the RF power source to provide the isolation between the RF power source and the AC power source, wherein the plurality of capacitors of the second circuit are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the AC power source.

### Claim 6 (depends on 1)

The isolation system of claim 1, wherein the slip ring is connected to the first circuit and to the second circuit, wherein the slip ring includes a first channel and a second channel, wherein the first circuit includes a first capacitor and a second capacitor, wherein the second circuit includes a third capacitor and a fourth capacitor, wherein the first channel is coupled between the first capacitor and the third capacitor and the second channel is coupled between the second capacitor and the fourth capacitor.

### Claim 7 (depends on 1)

The isolation system of claim 1, wherein the slip ring has a top portion and a bottom portion, wherein the electrical interface of the slip ring is the top portion that is configured to rotate and the bottom portion of the slip ring is configured to remain fixed.

### Claim 8

An isolation system comprising:
a first circuit having a first plurality of filter elements, wherein the first circuit is configured to be coupled to a temperature sensor associated with a substrate support of a plasma chamber;
a second circuit having a second plurality of filter elements, wherein the second circuit is configured to be coupled to a radio frequency (RF) power source and to a temperature controller, wherein the first and second circuits are configured to provide isolation between the RF power source and direct current (DC) power that is associated with the temperature sensor;
a slip ring coupled between the first circuit and the second circuit, wherein the slip ring provides an electrical interface configured to communicate RF power from the RF power source and the DC power,
wherein the first circuit and the substrate support are configured to rotate and the electrical interface of the slip ring is configured to rotate to enable the second circuit to remain fixed and connected to the RF power source and the temperature controller.

### Claim 9 (depends on 8)

The isolation system of claim 8, wherein the first plurality of filter elements include a first capacitor and a second capacitor, wherein the first capacitor is coupled to the second capacitor and both the first and second capacitors are configured to be coupled to a lower electrode of the substrate support.

### Claim 10 (depends on 9)

The isolation system of claim 9, wherein the second plurality of filter elements include a third capacitor and a fourth capacitor, wherein the third capacitor is coupled to the fourth capacitor and both the third and fourth capacitors are configured to be coupled to the RF power source and the temperature controller.

### Claim 11 (depends on 8)

The isolation system of claim 8, wherein the first circuit includes a plurality of capacitors to filter out the DC power received from the temperature sensor to prevent the DC power from being supplied to a lower electrode of the substrate support to provide the isolation between the RF power source and the DC power, wherein the plurality of capacitors of the first circuit are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the DC power.

### Claim 12 (depends on 11)

The isolation system of claim 11, wherein the second circuit includes a plurality of capacitors to filter out the DC power received from the temperature sensor via the slip ring to prevent the DC power from being supplied to the RF power source to provide the isolation between the RF power source and the DC power, wherein the plurality of capacitors of the second circuit are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the DC power.

### Claim 13 (depends on 8)

The isolation system of claim 8, wherein the slip ring is connected to the first circuit and to the second circuit, wherein the slip ring includes a first channel and a second channel, wherein the first circuit includes a first capacitor and a second capacitor, wherein the second circuit includes a third capacitor and a fourth capacitor, wherein the first channel is coupled between the first capacitor and the third capacitor and the second channel is coupled between the second capacitor and the fourth capacitor.

### Claim 14 (depends on 8)

The isolation system of claim 8, wherein the slip ring has a top portion and a bottom portion, wherein the electrical interface of the slip ring is the top portion that is configured to rotate and the bottom portion of the slip ring is configured to remain fixed.

### Claim 15

An isolation system comprising:
a first circuit having a first plurality of filter elements, wherein the first circuit is configured to be coupled to a substrate support of a plasma chamber;
a second circuit having a second plurality of filter elements, wherein the second circuit is configured to be coupled to a radio frequency (RF) power source and an alternating current (AC) power source, wherein the first and second circuits are configured to provide isolation between the RF power source and the AC power source;
a slip ring coupled between the first circuit and the second circuit, wherein the slip ring provides an electrical interface configured to communicate both RF power from the RF power source and AC power from the AC power source,
wherein the first circuit and the substrate support are configured to rotate and the electrical interface of the slip ring is configured to rotate to enable the second circuit to remain fixed and connected to the RF power source and the AC power source;
a third circuit having a third plurality of filter elements, wherein the third circuit is configured to be coupled to a temperature sensor associated with the substrate support of the plasma chamber;
a fourth circuit having a fourth plurality of filter elements, wherein the fourth circuit is configured to be coupled to the RF power source and a temperature controller, wherein the third and fourth circuits are configured to provide isolation between the RF power source and direct current (DC) power that is associated with the temperature sensor,
wherein the slip ring provides the electrical interface configured to communicate the RF power from the RF power source and the DC power,
wherein the third circuit and the substrate support are configured to rotate and the electrical interface of the slip ring is configured to rotate to enable the fourth circuit to remain fixed and connected to the RF power source and the temperature controller.

### Claim 16 (depends on 15)

The isolation system of claim 15, wherein the first plurality of filter elements include a first capacitor and a second capacitor, wherein the first capacitor is coupled to the second capacitor and both the first and second capacitors are configured to be coupled to a lower electrode of the substrate support,
wherein the third plurality of filter elements include a third capacitor and a fourth capacitor, wherein the third capacitor is coupled to the fourth capacitor and both the third and fourth capacitors are configured to be coupled to the lower electrode of the substrate support.

### Claim 17 (depends on 16)

The isolation system of claim 16, wherein the second plurality of filter elements include a fifth capacitor and a sixth capacitor, wherein the fifth capacitor is coupled to the sixth capacitor and both the fifth and sixth capacitors are configured to be coupled to the RF power source and the AC power source,
wherein the fourth plurality of filter elements include a seventh capacitor and an eighth capacitor, wherein the seventh capacitor is coupled to the eighth capacitor and both the seventh and eighth capacitors are configured to be coupled to the RF power source and the temperature controller.

### Claim 18 (depends on 15)

The isolation system of claim 15, wherein the first circuit includes a first plurality of capacitors to filter out the AC power received from the AC power source via the slip ring to prevent the AC power from being supplied to a lower electrode of the substrate support to provide the isolation between the RF power source and the AC power source, wherein the first plurality of capacitors are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the AC power source,
wherein the third circuit includes a second plurality of capacitors to filter out the DC power received from the temperature sensor to prevent the DC power from being supplied to the lower electrode of the substrate support to provide the isolation between the RF power source and the DC power, wherein the second plurality of capacitors are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the DC power.

### Claim 19 (depends on 18)

The isolation system of claim 18, wherein the second circuit includes a third plurality of capacitors to filter out the AC power received from the AC power source to prevent the AC power from being supplied to the RF power source to provide the isolation between the RF power source and the AC power source, wherein the third plurality of capacitors are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the AC power source,\
wherein the fourth circuit includes a fourth plurality of capacitors to filter out the DC power received from the temperature sensor to prevent the DC power from being supplied to the RF power source to provide the isolation between the RF power source and the DC power, wherein the fourth plurality of capacitors are configured to enable a supply of the RF power to the lower electrode to provide the isolation between the RF power source and the DC power.

### Claim 20 (depends on 15)

The isolation system of claim 15, wherein the slip ring is connected to the first circuit and to the second circuit, wherein the slip ring includes a first channel and a second channel, wherein the first circuit includes a first capacitor and a second capacitor, wherein the second circuit includes a third capacitor and a fourth capacitor, wherein the first channel is coupled between the first capacitor and the third capacitor and the second channel is coupled between the second capacitor and the fourth capacitor,
wherein the slip ring is connected to the third circuit and to the fourth circuit, wherein the slip ring includes a third channel and a fourth channel, wherein the third circuit includes a fifth capacitor and a sixth capacitor, wherein the fourth circuit includes a seventh capacitor and an eighth capacitor, wherein the third channel is coupled between the fifth capacitor and the seventh capacitor and the fourth channel is coupled between the sixth capacitor and the eighth capacitor.

### Claim 21 (depends on 15)

The isolation system of claim 15, wherein the slip ring has a top portion and a bottom portion, wherein the electrical interface of the slip ring is the top portion that is configured to rotate and the bottom portion of the slip ring is configured to remain fixed.
