# US 10,373,767 B2 · Structural supercapacitor composite and method of making same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,767 B2 - Document ID: US10373767B2 - Status: Granted - Kind: B2 - Application number: 15/819,217 - Filed: 2017-11-21 - Published: 2019-05-23 - Granted: 2019-08-06 - Earliest claimed: 2017-11-21 - Assignees: Vactronix Scientific, LLC - Applicants: Vactronix Scientific, LLC - Inventors: Christian Gaston Palmaz; Julio C. Palmaz - Web page: https://patentgrep.com/patent/US10373767B2 ## CPC - H01G 11/84: Processes for the manufacture of hybrid or EDL capacitors, or components thereof - H01G 11/08: Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component - H01G 11/10: Multiple hybrid or EDL capacitors, e.g. arrays or modules (housings, cases, encapsulations or mountings thereof H01G11/78) - Y02E 60/13: Energy storage using capacitors - Y02T 10/70: Energy storage systems for electromobility, e.g. batteries - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02T: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION ## Abstract The present invention is a multi-layer modular capacitor that can be adapted to be electrically coupled to other multi-layer modular capacitors and formed into a structural piece that is electrically coupled to an electrical device requiring a power supply. One aspect of the invention includes a method of forming the multi-modular capacitor. ## Claims ### Claim 1 An electrical capacitor assembly, comprising a plurality of modular electrical capacitors formed into a three-dimensional structural member and coupled to a primary electrical power source, each of the plurality of electrical capacitors comprising at least one conductive layer having at least one conductive projection extending from the at least one conductive layer and at least one dielectric layer adjacent to the at least one conductive layer; wherein adjacent electrical capacitors are electrically coupled to each other by engaging the at least one conductive projection of a first electrical capacitor with the at least one conductive layer of a second electrical capacitor adjacent the first electrical capacitor. ### Claim 2 (depends on 1) The electrical capacitor assembly of claim 1, wherein each modular electrical capacitor of the plurality of modular electrical capacitors further comprises a plurality of alternating dielectric layers and vacuum deposited conductive layers, each vacuum deposited conductive layer having at least one conductive projection extending therefrom. ### Claim 3 (depends on 2) The electrical capacitor assembly of claim 2, wherein the plurality of modular electrical capacitors further is configured as an array of electrically coupled electrical capacitor units positioned in the X-axis and/or Y-axis of individual electrical capacitors. ### Claim 4 (depends on 3) The electrical capacitor assembly of claim 3, wherein the array of electrically coupled electrical capacitor units is coupled to a three-dimensional structural member. ### Claim 5 (depends on 1) The electrical capacitor assembly of claim 1, wherein the at least one electrical capacitor has a thickness between about 1 micron to about 10 millimeters. ### Claim 6 (depends on 5) The electrical capacitor assembly of claim 5, wherein the at least one electrical capacitor has greater than about 100 layers of conductive and dielectric layers. ### Claim 7 (depends on 6) The electrical capacitor assembly of claim 6, wherein each of the conductive and dielectric layers has a thickness between about 10 nm to about 1 micron. ### Claim 8 (depends on 3) The electrical capacitor assembly of claim 3, wherein the array of modular electrical capacitors is formed into a tubular shape. ### Claim 9 (depends on 1) The electrical capacitor assembly of claim 1, wherein the at least one modular electrical capacitor is coupled to at least a second modular electrical capacitor by coupling the at least one electrical capacitor assembly conductive projections to the at least second electrical capacitor conductive projections. ### Claim 10 (depends on 1) The electrical capacitor assembly of claim 1, wherein the at least one modular electrical capacitor is coupled to at least a second modular electrical capacitor by coupling the at least one modular electrical capacitor assembly conductive projections to a detachable connector member and coupling the at least second modular electrical capacitor to the detachable connector member, the detachable connector member electrically coupling the at least one electrical capacitor and the at least second electrical capacitor. ### Claim 11 (depends on 1) A method of forming the electrical capacitor assembly of claim 1 comprising the steps of: a. providing a deposition substrate; b. depositing a first conductive layer onto the deposition substrate and forming at least one conductive projection projecting outwardly from the first conductive layer; c. depositing a first dielectric layer onto the first conductive layer and forming at least one dielectric projection projecting outwardly from the first dielectric layer; and d. depositing a second conductive layer onto the first dielectric layer and forming at least one conductive projection projecting outwardly from the second conductive layer. ### Claim 12 (depends on 11) The method of forming an electrical capacitor assembly of claim 11 further comprising the steps alternately depositing onto the second conductive layer successive dielectric layers having at least one dielectric projection and conductive layers having at least one conductive projection. ### Claim 13 (depends on 11) The method of forming an electrical capacitor assembly of claim 11 further comprising the steps of coupling the conductive projections of the first conductive layer and second conductive layer to a power supply. ### Claim 14 (depends on 11) The method of forming an electrical capacitor assembly of claim 11 wherein the step of providing a deposition substrate includes providing a planar deposition substrate. ### Claim 15 (depends on 11) The method of forming an electrical capacitor assembly of claim 11 wherein the step of providing a deposition substrate includes providing a cylindrical deposition substrate. ### Claim 16 (depends on 11) The method of forming an electrical capacitor assembly of claim 11 further comprising forming a first electrical capacitor assembly through steps a-d and forming an at least second electrical capacitor assembly through steps a-d, and further coupling the first electrical capacitor assembly and the at least second electrical capacitor assembly by coupling the first electrical capacitor assembly conductive projections and dielectric projections to the at least second electrical capacitor assembly conductive projections and dielectric projections. ### Claim 17 (depends on 16) The method of forming an electrical capacitor assembly of claim 16 wherein the step of coupling the first electrical capacitor assembly and the at least second electrical capacitor assembly further includes coupling the first electrical capacitor assembly conductive projections and dielectric projections to a detachable connector member and coupling the at least second electrical capacitor assembly to the detachable connector member, the detachable connector member electrically coupling the first electrical capacitor assembly and the at least second electrical capacitor assembly. ### Claim 18 (depends on 16) The method of forming an electrical capacitor assembly of claim 16 wherein the step of coupling the first electrical capacitor assembly and the at least second electrical capacitor further comprises the step of forming a an electrical capacitor assembly having a tubular shape.