# US 10,373,757 B2 · Printed circuit board, antenna, and wireless charging device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,373,757 B2
- Document ID: US10373757B2
- Status: Granted
- Kind: B2
- Application number: 15/318,472
- Filed: 2015-07-01
- Published: 2017-05-11
- Granted: 2019-08-06
- Earliest claimed: 2014-07-07
- Assignees: Sumitomo Electric Printed Circuits, Inc.
- Applicants: Sumitomo Electric Printed Circuits, Inc.
- Inventors: Masahiko Kouchi; Tetsuya Shimomura
- Web page: https://patentgrep.com/patent/US10373757B2

## CPC

- H01F 38/14: Inductive couplings
- H01F 27/2804: {Printed windings}
- H01F 27/366: {made of ferromagnetic material}
- H02J 50/005: {Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices}
- H02J 50/12: of the resonant type
- H02J 50/70: involving the reduction of electric, magnetic or electromagnetic leakage fields
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 1/165: {incorporating printed inductors}
- H01F 27/2809: {on stacked layers}
- H01F 27/36: Electric or magnetic shields or screens (movable for varying inductance H01F21/10)
- H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards}
- H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between
- H05K 2201/09227: Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
- H05K 2201/09536: Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
- H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.

## Claims

### Claim 1

A printed circuit board comprising: alternately,
at least one insulating layer containing a synthetic resin as a main component; and
a plurality of conductive layers including circuit patterns,
wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and
the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern,
wherein the conductive layers are formed on both surfaces of the at least one insulating layer so as to form a pair;
wherein the spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows and a bridging circuit,
the multi-row circuits include a first multi-row circuit formed in a conductive layer on one of surfaces of the at least one insulating layer, and a second multi-row circuit formed in a conductive layer on another one of the surfaces of the at least one insulating layer and being adjacent to the first multi-row circuit, and
the bridging circuit connects an end portion of the first multi-row circuit to an end portion of the second multi-row circuit;
wherein the multi-row circuits are circular arc circuits that have different radii and are concentrically arranged so as to form multi-rows;
wherein, in 70% or more of a total length of the spiral pattern, the plurality of circuit patterns of the plurality of conductive layers overlap in plan view; and
wherein the bridging circuit includes a circuit extending from an end portion of the first multi-row circuit in a radial direction of the circular arc of the first multi-row circuit in plan view and connecting to the through-hole.

### Claim 2 (depends on 1)

The printed circuit board according to claim 1, wherein the plurality of multi-row circuits have a length corresponding to less than one turn of the spiral pattern.

### Claim 3 (depends on 1)

The printed circuit board according to claim 1, wherein, in 70% or more of a total length of the spiral pattern, a voltage difference between any one point of a circuit pattern of a conductive layer on one of surfaces of the at least one insulating layer and a point of a circuit pattern of a conductive layer on another one of the surfaces of the at least one insulating layer, the point being nearest to the one point, is 50% or less of a voltage drop of the entirety of the spiral pattern.

### Claim 4 (depends on 1)

The printed circuit board according to claim 1, wherein the at least one insulating layer has flexibility.

### Claim 5 (depends on 1)

An antenna comprising the printed circuit board according to claim 1.

### Claim 6 (depends on 5)

A wireless charging device comprising a transmitter and a receiver,
wherein the transmitter and the receiver include the antenna according to claim 5.