# US 10,373,749 B2 · Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device

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- Number: US 10,373,749 B2
- Document ID: US10373749B2
- Status: Granted
- Kind: B2
- Application number: 15/025,473
- Filed: 2014-09-18
- Published: 2016-07-21
- Granted: 2019-08-06
- Earliest claimed: 2013-10-01
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Shotaro Masuda; Hirofumi Ebe; Takashi Habu; Akihito Matsutomi
- Web page: https://patentgrep.com/patent/US10373749B2

## CPC

- H01F 1/28: dispersed or suspended in a bonding agent
- B22F 1/0011
- B22F 1/0055
- H01F 3/08: made from powder (powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06)
- H01F 5/00: Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00)
- H05K 3/285: {Permanent coating compositions}
- B22F 2007/042: {characterised by the layer forming method}
- C22C 33/0257: {characterised by the range of the alloying elements}
- C22C 2202/02: Magnetic
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 2201/0245: Flakes, flat particles or lamellar particles
- H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

## Claims

### Claim 1

Soft magnetic particle powder composed of flat soft magnetic particles,
wherein the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below:
D10/D50>0.45,
wherein the particle size D50 is 40 μm or more, and
wherein the soft magnetic particle powder has a particle size D90 measured with the laser diffraction particle size distribution analyzer that is 100 μm or more and 150 μm or less.

### Claim 2 (depends on 1)

A soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

### Claim 3 (depends on 2)

The soft magnetic resin composition according to claim 2, wherein
the resin component contains epoxy resin, phenol resin, and acrylic resin.

### Claim 4 (depends on 1)

A soft magnetic film formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

### Claim 5 (depends on 1)

A soft magnetic film laminated circuit board produced by laminating a soft magnetic film on a circuit board, wherein
the soft magnetic film is formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

### Claim 6 (depends on 1)

A position detection device comprising:
a soft magnetic film laminated circuit board produced by laminating a soft magnetic film on a circuit board, wherein
the soft magnetic film is formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.