# US 10,373,747 B2 · Magnetic inductor stacks

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- Number: US 10,373,747 B2
- Document ID: US10373747B2
- Status: Granted
- Kind: B2
- Application number: 15/403,292
- Filed: 2017-01-11
- Published: 2018-07-12
- Granted: 2019-08-06
- Earliest claimed: 2017-01-11
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Hariklia Deligianni; Bruce B. Doris; Eugene J. O'Sullivan; Naigang Wang
- Web page: https://patentgrep.com/patent/US10373747B2

## CPC

- H01F 1/14766: {Fe-Si based alloys}
- H01F 1/14708: {Fe-Ni based alloys (pure Fe or Ni H01F1/14, H01F1/16 or H01F1/20)}
- H01F 10/265: {Magnetic multilayers non exchange-coupled (H01F10/32 takes precedence)}
- H01F 17/0013: {with stacked layers}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H01F 2017/0066: {with a magnetic layer}
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

A magnetic laminating inductor structure and process for preventing substrate bowing and damping losses generally include a laminated film stack including a magnetic layer having a tensile stress, an insulating layer having a compressive stress disposed on the magnetic layer, and a dielectric planarizing layer on the insulating layer. The dielectric planarizing layer has a neutral stress and a roughness value less than the insulating layer. The reduction in surface roughness reduces damping losses and the compressive stress of the insulating layers reduces wafer bowing.

## Claims

### Claim 1

An inductor structure comprising:
one or more metal lines; and
a laminated film stack enclosing the one or more metal lines, the laminated film stack comprising a plurality of alternating magnetic layers having a tensile stress and insulating layers having a compressive stress disposed on the magnetic layer, and a dielectric planarizing layer at a thickness of 1 nm to 50 nm on only selected ones of the insulating layers, wherein the dielectric planarizing layer has a neutral stress and a roughness value less than the insulating layer.

### Claim 2 (depends on 1)

The inductor structure of claim 1, wherein the dielectric planarizing layer is only on each one of the insulating layers in the laminated film stack.

### Claim 3 (depends on 1)

The inductor structure of claim 1, wherein the layers of the magnetic materials have a cumulative thickness greater than 0.8 micrometers.

### Claim 4 (depends on 1)

The inductor structure of claim 1, wherein the dielectric planarizing layer is a spin-on or a flowable dielectric material.

### Claim 5 (depends on 1)

The inductor structure of claim 1, wherein the dielectric planarizing layer comprises silicate, a siloxane, a methyl silsesquioxane (MSQ), a hydrogen silsesquioxane (HSQ), an MSQ/HSQ, a perhydrosilazane (TCPS), a polysilazane, or a phosphosilicate.

### Claim 6 (depends on 1)

The inductor structure of claim 1, wherein the magnetic layers have a tensile stress value in a range from 50 to 400 megapascals.

### Claim 7 (depends on 1)

The inductor structure of claim 1, wherein the magnetic material is selected from the group consisting of CoFe, CoFeB, CoZrTi, CoZrTa, CoZr, CoZrNb, CoZrMo, CoTi, CoNb, CoHf, CoW, FeCoN, FeCoAlN, CoP, FeCoP, CoPW, CoBW, CoPBW, FeTaN, FeCoBSi, FeNi, CoFeHfO, CoFeSiO, CoZrO, CoFeAlO, and combinations thereof.

### Claim 8 (depends on 1)

The inductor structure of claim 1, wherein the insulator materials are selected from the group consisting of silicon dioxide, silicon nitride, silicon oxynitride, magnesium oxide, aluminum oxide, and combinations thereof.

### Claim 9 (depends on 1)

The inductor structure of claim 1, wherein the insulator material layers have a compressive stress of −50 to −400 megapascals for thicknesses at about one half a thickness for the magnetic material layer.