# US 10,372,166 B2 · Coupling structures for electronic device housings > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,372,166 B2 - Document ID: US10372166B2 - Status: Granted - Kind: B2 - Application number: 15/212,029 - Filed: 2016-07-15 - Published: 2018-01-18 - Granted: 2019-08-06 - Earliest claimed: 2016-07-15 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Brian M. Gable; Carlo Di Nallo; Colin M. Ely; Craig A. Horton; Erik G. de Jong; Fletcher R. Rothkopf; Henry B. Wettersten; Hoishun Li; Jason C. Sauers; Jayesh Nath; Mario Martinis; Mattia Pascolini; Michael P. Coleman; Rex T. Ehman; Zheyu Wang - Web page: https://patentgrep.com/patent/US10372166B2 ## CPC - G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)} - B29C 70/763: {the edges being disposed in a substantial flat plane} - H01Q 1/22: by structural association with other equipment or articles - H01Q 1/243: {with built-in antennas} - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H04B 1/3888: Arrangements for carrying or protecting transceivers - H04M 1/0202: {Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03)} - H04M 1/0249: {Details of the mechanical connection between the housing parts or relating to the method of assembly} - H04M 1/18: Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment (H04M1/19 takes precedence) - H05K 5/04: Metal casings - H05K 5/15: assembled by resilient members - B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements} - G06F 1/163: {Wearable computers, e.g. on a belt} - G06F 1/1637: {Details related to the display arrangement, including those related to the mounting of the display in the housing} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04B: TRANSMISSION - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed. ## Claims ### Claim 1 A housing for an electronic device, comprising: a first conductive component defining: a first portion of a curved exterior surface of the housing; a first interface surface; and a first interlock feature; a second conductive component defining: a second portion of the curved exterior surface of the housing; a second interface surface facing the first interface surface; and a second interlock feature; and a joint structure between the first and second interface surfaces, comprising: a molded element defining: first and second corresponding interlock features engaged with the first and second interlock features, respectively, and fixing the first conductive component to the second conductive component; and a third portion of the curved exterior surface of the housing, the third portion positioned between and adjacent to the first and second portions of the curved exterior surface; and a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components. ### Claim 2 (depends on 1) The housing of claim 1, wherein: the sealing member and the molded element are electrical insulators; and the sealing member and the molded element electrically isolate the first conductive component from the second conductive component. ### Claim 3 (depends on 1) The housing of claim 1, wherein: the first and second interlock features are dovetail channels. ### Claim 4 (depends on 1) The housing of claim 1, wherein the sealing member comprises an elastomeric material. ### Claim 5 (depends on 1) The housing of claim 1, wherein the sealing member is compressed between the first and second interface surfaces. ### Claim 6 (depends on 1) The housing of claim 1, wherein: the molded element is a first molded element; and the sealing member is a second molded element. ### Claim 7 (depends on 1) The housing of claim 1, wherein the curved exterior surface of the housing is located at a perimeter of the housing. ### Claim 8 An electronic device, comprising: a display; a cover over the display; and a housing configured to receive the display and the cover, comprising: a first component receiving the cover thereon and defining: a first exterior surface region of the housing; and a first interlock feature; a second component forming at least part of an interior cavity of the housing and defining: a second exterior surface region of the housing; and a second interlock feature; and a joint structure positioned in a gap between the first and second components, comprising: a molded element mechanically engaged with the first and second interlock features to inhibit expansion of the gap, the molded element defining a third exterior surface region between the first and second exterior surface regions; and an elastomeric sealing member abutting the molded element and between the first and second components; wherein the third exterior surface region, a portion of the first exterior surface region adjacent the molded element, and a portion of the second exterior surface region adjacent the molded element together define a continuous surface. ### Claim 9 (depends on 8) The electronic device of claim 8, wherein: the first and second components are formed of a conductive metal; the elastomeric sealing member and the molded element are electrical insulators; and the elastomeric sealing member and the molded element electrically isolate the first component from the second component. ### Claim 10 (depends on 8) The electronic device of claim 8, wherein: the first interlock feature comprises a channel extending around a perimeter of the electronic device. ### Claim 11 (depends on 10) The electronic device of claim 10, wherein the channel is a dovetail channel. ### Claim 12 (depends on 8) The electronic device of claim 8, wherein the elastomeric sealing member is subject to a residual compressive force by the first and second components. ### Claim 13 (depends on 8) The electronic device of claim 8, wherein: the first component defines an opening configured to receive the display and the cover therein; and the elastomeric sealing member extends around a perimeter of the opening. ### Claim 14 (depends on 8) The electronic device of claim 8, wherein the molded element is formed of a polymer material. ### Claim 15 (depends on 8) The electronic device of claim 8, wherein the molded element conforms to a shape of the elastomeric sealing member.