# US 10,372,036 B2 · Mold, method of producing mold, production apparratus, and method of manufacturing semiconductor device

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- Number: US 10,372,036 B2
- Document ID: US10372036B2
- Status: Granted
- Kind: B2
- Application number: 15/693,096
- Filed: 2017-08-31
- Published: 2018-05-24
- Granted: 2019-08-06
- Earliest claimed: 2016-11-21
- Assignees: Kabushiki Kaisha Toshiba; The University of Tokyo
- Applicants: Kabushiki Kaisha Toshiba; The University of Tokyo
- Inventors: Yongfang Li; Hiroyuki Fujita
- Web page: https://patentgrep.com/patent/US10372036B2

## CPC

- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- G03F 7/0015: {Production of aperture devices, microporous systems or stamps}
- H10P 50/00: Etching of wafers, substrates or parts of devices
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A edge electrode mold according to an embodiment includes a base having a first main surface and one or more protruding structures disposed on the first main surface. The protruding structures include a protrusion projecting from the first main surface of the base, an edge electrode disposed at the protrusion, and an electrolytic hydrophobic film having electrolytic property and hydrophobicity disposed on the upper end surface of a protruding shape including the protrusion and the edge electrode.

## Claims

### Claim 1

A mold comprising:
a base having s first main surface; and
one or more protruding structure disposed on the first main surface,
the protruding structures comprising;
a protrusion projecting from the first main surface of the base,
a first electrode disposed at the protrusion, and
an electrolytic hydrophobic film disposed on an upper surface of a protruding shape including the protrusion and the first electrode, the electrolytic hydrophobic film having electrolytic property and hydrophobicity.

### Claim 2 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film is formed of a material having hydrophobicity higher than a material that forms the protrusion.

### Claim 3 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film is a monomolecular layer.

### Claim 4 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film has a film thickness of not less than 1 nm and not more than 10 nm.

### Claim 5 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film includes organic silane.

### Claim 6 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film includes hexamethyldisilazane.

### Claim 7 (depends on 1)

The mold according to claim 1, wherein the electrolytic hydrophobic film has a hardness lower than a hardness of the protrusion.

### Claim 8 (depends on 1)

The mold according to claim 1, wherein the first electrode is disposed on each of at least two of side surfaces of the protrusion.

### Claim 9 (depends on 1)

The mold according to claim 1, wherein the protruding structures further comprise an insulating film interposed between the protrusion and the first electrode.

### Claim 10 (depends on 1)

The mold according to claim 1, wherein the protruding structures further comprise an insulating film disposed on an upper end surface of the protrusion.

### Claim 11 (depends on 10)

The mold according to claim 10, wherein the electrolytic hydrophobic film is formed of a material having hydrophobicity higher than a material that forms the insulating film.

### Claim 12 (depends on 1)

The mold according to claim 1, wherein
the protruding structures further comprises:
an insulating film disposed on a second side surface of the first electrode, the second side surface being opposite to a first side surface opposed to the protrusion, and
a second electrode disposed on a fourth side surface of the insulating film, the fourth side surface being opposite to a third side surface in contact with the first electrode, and
the electrolytic hydrophobic film is disposed on an upper end surface of the protruding shape including the insulating film and the second electrode in addition to the protrusion and the first electrode.

### Claim 13 (depends on 1)

A production apparatus comprising;
the mold according to claim 1;
a substrate holder configured to bold a transfer target;
a mold holder configured to hold the mold such that the first main surface is opposed to a pattern transfer surface of the transfer target placed on the substrate holder; and
a power supply configured to apply a potential difference between the transfer target and the mold.