# US 10,372,024 B2 · Electronic unit having heat dissipating device, method for fabricating electronic unit and projector having electronic unit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,372,024 B2 - Document ID: US10372024B2 - Status: Granted - Kind: B2 - Application number: 15/066,024 - Filed: 2016-03-10 - Published: 2016-11-24 - Granted: 2019-08-06 - Earliest claimed: 2015-05-20 - Assignees: Casio Computer Co., Ltd. - Applicants: Casio Computer Co., Ltd. - Inventors: Toshifumi Kase; Hirofumi Fujikura - Web page: https://patentgrep.com/patent/US10372024B2 ## CPC - G03B 21/16: Cooling; Preventing overheating - H04N 9/3144: {Cooling systems (cooling of liquid crystal cells in general G02F1/133382; cooling of projectors not peculiar to the presence of an electronic spatial light modulator G03B21/16)} - H05K 13/00: Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic unit is provided including a heat dissipating device having a projecting heat transfer portion, a substrate on one surface side of which the heat dissipating device is disposed and in which an opening portion where the heat transfer portion is inserted is formed, an electronic part disposed on the other surface side of the substrate so that a heat dissipating surface is positioned in the opening portion and connected to the substrate via a frame-shaped connecting portion disposed with a gap between the substrate and itself, and a heat conductive member provided between the heat transfer portion and the heat dissipating surface and between an outer circumference of the heat transfer portion and an inner circumference of the connecting portion, wherein an end portion of the heat conductive member is positioned closer to the heat dissipating device than the gap between the connecting portion and the substrate. ## Claims ### Claim 1 An electronic unit comprising: a heat dissipating device comprising a projecting heat transfer portion; a substrate on one surface side of which the heat dissipating device is disposed and in which an opening portion where the projecting heat transfer portion of the heat dissipating device is inserted is formed by an inner circumference of the substrate; an electronic part which is disposed on the other surface side of the substrate; a frame-shaped connecting portion which connects a heat dissipating surface of the electronic part to the substrate; and a heat conductive member formed as a single member provided between the projecting heat transfer portion of the heat dissipating device and the heat dissipating surface of the electronic part and between an outer circumference of the projecting heat transfer portion of the heat dissipating device and an inner circumference of the frame-shaped connecting portion, wherein the projecting heat transfer portion of the heat dissipating device is inserted into the opening portion of the substrate to press the heat conductive member formed as the single member so that a part of the heat conductive member formed as the single member seals a first gap that is a space between the outer circumference of the projecting heat transfer portion and the inner circumference of the substrate to block access by dust to a second gap that is a space between the frame-shaped connecting portion and the substrate. ### Claim 2 (depends on 1) The electronic unit according to claim 1, wherein the heat dissipating device comprises a heat dissipating portion, and the projecting heat transfer portion of the heat dissipating device transfers heat to the heat dissipating portion, and wherein the projecting heat transfer portion has a rectangular section when seen from a front. ### Claim 3 (depends on 2) The electronic unit according to claim 2, wherein the heat dissipating portion is formed by a plurality of heat dissipating fins, wherein the projecting heat transfer portion is formed continuously in a section when seen from a side, and wherein a direction in which the projecting heat transfer portion is formed continuously in the section when seen from the side is the same as a direction in which grooves are defined by the plurality of heat dissipating fins. ### Claim 4 (depends on 2) The electronic unit according to claim 2, wherein the projecting heat transfer portion has one of a trapezoidal shape which expands obliquely as it extends towards a proximal end, a shape in which two rectangles which differ in size are superposed on each other in two stages in section, a shape in which a distal end portion is formed into an obtuse-angled shape in section and a shape in which a distal end face is formed into a waveform when seen from a side. ### Claim 5 (depends on 3) The electronic unit according to claim 3, wherein the projecting heat transfer portion has one of a trapezoidal shape which expands obliquely as it extends towards a proximal end, a shape in which two rectangles which differ in size are superposed on each other in two stages in section, a shape in which a distal end portion is formed into an obtuse-angled shape in section and a shape in which a distal end face is formed into a waveform when seen from a side. ### Claim 6 (depends on 2) The electronic unit according to claim 2, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 7 (depends on 3) The electronic unit according to claim 3, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 8 (depends on 1) The electronic unit according to claim 1, wherein the projecting heat transfer portion has one of a trapezoidal shape which expands obliquely as it extends towards a proximal end, a shape in which two rectangles which differ in size are superposed on each other in two stages in section, a shape in which a distal end portion is formed into an obtuse-angled shape in section and a shape in which a distal end face is formed into a waveform when seen from a side. ### Claim 9 (depends on 4) The electronic unit according to claim 4, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 10 (depends on 5) The electronic unit according to claim 5, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 11 (depends on 8) The electronic unit according to claim 8, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 12 (depends on 1) The electronic unit according to claim 1, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 13 (depends on 1) The electronic unit according to claim 1, comprising a biasing device which biases the heat dissipating device towards the electronic part. ### Claim 14 (depends on 13) The electronic unit according to claim 13, wherein the biasing device comprises a plate spring having an internally threaded portion which allows the heat dissipating device to be fixed with a bolt. ### Claim 15 (depends on 1) The electronic unit according to claim 1, wherein the heat conductive member has a sheet-like shape, and wherein the projecting heat transfer portion of the heat dissipating device is inserted into the opening portion of the substrate to plastically deform the heat conductive member so that an outer circumferential end portion of the sheet-like shape of the heat conductive member seals the first gap between the outer circumference of the projecting heat transfer portion and the inner circumference of the substrate to block access by dust to the second gap between the frame-shaped connecting portion and the substrate. ### Claim 16 (depends on 1) The electronic unit according to claim 1, wherein the electronic part comprises a display device, and wherein the heat dissipating device is a heat sink. ### Claim 17 (depends on 1) A projector comprising: the electronic unit according to claim 1, wherein the electronic part comprises a display device; a light source unit comprising a red light source device, a green light source device, and a blue light source device; a light source-side optical system configured to guide light from the light source unit to the display device; a projection-side optical system configured to project an image emitted from the display device; and a projector control unit configured to control the light source unit and the display device. ### Claim 18 (depends on 1) The electronic unit according to claim 1, wherein the first gap is larger than the second gap. ### Claim 19 A fabrication method comprising: disposing a substrate having an inner circumference that defines an opening portion and a heat dissipating surface of an electronic part, wherein the electronic part is connected to the substrate via a frame-shaped connecting portion, such that the electronic part and the substrate face each other and are fixable in position; placing a sheet-shaped heat conductive member having a predetermined thickness on the heat dissipating surface of the electronic part; and disposing a heat dissipating device comprising a heat dissipating portion and a projecting heat transfer portion configured to transfer heat to the heat dissipating portion such that the projecting heat transfer portion is inserted into the opening portion of the substrate to plastically deform the heat conductive member so that a part of the heat conductive member seals a first gap that is a space between an outer circumference of the projecting heat transfer portion and the inner circumference of the substrate to block access by dust to a second gap that is a space between the frame-shaped connecting portion and the substrate.