# US 10,371,909 B2 · Thermal interface

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- Number: US 10,371,909 B2
- Document ID: US10371909B2
- Status: Granted
- Kind: B2
- Application number: 15/457,717
- Filed: 2017-03-13
- Published: 2017-09-14
- Granted: 2019-08-06
- Earliest claimed: 2016-03-11
- Assignees: Finisar Corporation
- Applicants: Finisar Corporation
- Inventors: Troy Wy Piew Chiang; Julia Koh; Tat Ming Teo; William H. Wang
- Web page: https://patentgrep.com/patent/US10371909B2

## CPC

- G02B 6/4267: {Reduction of thermal stress, e.g. by selecting thermal coefficient of materials}
- G02B 6/4269: {with heat sinks or radiation fins}
- G02B 6/4271: {with thermo electric cooling}
- G02B 6/4273: {with heat insulation means to thermally decouple or restrain the heat from spreading}
- G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- G02B 6/4246: {Bidirectionally operating package structures}
- H04B 10/40: Transceivers
- H04B 10/50: Transmitters
- H04B 10/501: {Structural aspects}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H04B: TRANSMISSION

## Abstract

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

## Claims

### Claim 1

An optoelectronic module comprising:
a shell including a seat;
an optical subassembly including a header having a plurality of leads;
a thermal interface comprising:
a thermally conductive cap including:
a base defining a plurality of cap openings, the base having a substantially circular shape;
a plurality of fingers extending from the base; and
an extension extending from an edge of the base, the extension including a curved shape substantially corresponding to a circumferential portion of the base, the extension having a length greater than a length of the plurality of fingers;
a gasket defining a plurality of gasket openings smaller than the cap openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings, wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell;
an adhesive located between the gasket and the base of the cap; and
a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material.

### Claim 2 (depends on 1)

The optoelectronic module of claim 1, wherein the optical subassembly includes a transmitter optical subassembly.

### Claim 3 (depends on 1)

The optoelectronic module of claim 1, wherein the cap includes copper.

### Claim 4 (depends on 1)

The optoelectronic module of claim 1, wherein the cap is positioned at an end face of the header of the optical subassembly.

### Claim 5 (depends on 1)

The optoelectronic module of claim 1, wherein the plurality of fingers are located at a side of the header of the optical subassembly.

### Claim 6 (depends on 1)

The optoelectronic module of claim 1, wherein the extension is located at a side of the header of the optical subassembly.

### Claim 7 (depends on 1)

The optoelectronic module of claim 1, wherein the cap is positioned at an end face of the header of the optical subassembly and the plurality of fingers are located at a side of the header of the optical subassembly.

### Claim 8 (depends on 1)

The optoelectronic module of claim 1, wherein the cap is positioned at an end face of the header of the optical subassembly and the extension is located at a side of the header of the optical subassembly.

### Claim 9 (depends on 1)

The optoelectronic module of claim 1, wherein the plurality of fingers and the extension are located at a side of the header of the optical subassembly.

### Claim 10 (depends on 1)

The optoelectronic module of claim 1, wherein the cap is positioned at an end face of the header of the optical subassembly and the plurality of fingers and the extension are located at a side of the header of the optical subassembly.

### Claim 11 (depends on 1)

The optoelectronic module of claim 1, wherein the gasket openings are approximately centered relative to the cap openings.

### Claim 12 (depends on 1)

The optoelectronic module of claim 1, wherein the pad is at least partially compressed between the seat of the shell and the extension of the cap.

### Claim 13 (depends on 1)

The optoelectronic module of claim 1, wherein the pad comprises multiple portions.

### Claim 14 (depends on 1)

The optoelectronic module of claim 1, wherein the plurality of fingers has a length approximately equal to a length of the header of the optical subassembly.

### Claim 15 (depends on 1)

The optoelectronic module of claim 1, wherein the optical subassembly includes a high power transistor outline-can based optical subassembly.

### Claim 16 (depends on 1)

The optoelectronic module of claim 1, wherein the adhesive includes an adhesive tape.

### Claim 17 (depends on 1)

The optoelectronic module of claim 1, wherein the adhesive includes an epoxy.

### Claim 18 (depends on 1)

The optoelectronic module of claim 1, wherein the plurality of fingers is soldered to the header of the optical subassembly.

### Claim 19 (depends on 1)

The optoelectronic module of claim 1, wherein the extension is soldered to the header of the optical subassembly.