# US 10,371,908 B2 · Method of manufacturing photoelectric conversion connectors, as well as photoelectric conversion connector and photoelectric conversion connector device utilizing same

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- Number: US 10,371,908 B2
- Document ID: US10371908B2
- Status: Granted
- Kind: B2
- Application number: 16/108,962
- Filed: 2018-08-22
- Published: 2018-12-20
- Granted: 2019-08-06
- Earliest claimed: 2016-09-01
- Assignees: Hirose Electric Co., Ltd.
- Applicants: Hirose Electric Co., Ltd.
- Inventors: Yoshiaki Sano
- Web page: https://patentgrep.com/patent/US10371908B2

## CPC

- G02B 6/4253: {by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence)}
- G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)}
- G02B 6/4255: {Moulded or casted packages}
- G02B 6/4257: {having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence)}
- G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)}
- G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}
- G02B 6/4295: {coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors}
- H10F 55/20: wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F 55/255: formed in, or on, a common substrate
- H10F 71/137: {Batch treatment of the devices}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10F 77/933: {for devices having potential barriers}
- G02B 6/428: {containing printed circuit boards [PCB]}
- Y02E 10/50: Photovoltaic [PV] energy
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.

## Claims

### Claim 1

A photoelectric conversion connector comprising:
a support member supporting connector components, comprising an optical semiconductor device configured to convert optical signals and electrical signals and a wiring pattern electrically connected to said optical semiconductor device;
a first resin member encapsulating the connector components; and
a second resin member used for molding onto the connector components encapsulated by the above-mentioned first resin member and molded at least partially on the first resin member;
wherein the second resin member has a waveguide supporting portion that supports an optical waveguide member used to transmit optical signals and a reflective surface that reflects optical signals and changes their optical path, thereby transmitting optical signals between the optical waveguide member and the optical semiconductor device, and
the wiring pattern is exposed on at least a portion of a circumferential face formed by the support member and the first resin member.

### Claim 2 (depends on 1)

The photoelectric conversion connector according to claim 1, wherein the support member has contact connecting portions on the surface opposite to the surface that supports the connector components.

### Claim 3 (depends on 1)

The photoelectric conversion connector of claim 1, further comprising a contact member connecting the contact connecting portions to a board.

### Claim 4 (depends on 3)

The photoelectric conversion connector according to claim 3, further comprising a shell covering an external surface of the photoelectric conversion connector device.