# US 10,371,724 B2 · Rectifier package module for vehicle and connection status detection method for temperature sensor thereof

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- Number: US 10,371,724 B2
- Document ID: US10371724B2
- Status: Granted
- Kind: B2
- Application number: 15/439,927
- Filed: 2017-02-22
- Published: 2018-06-28
- Granted: 2019-08-06
- Earliest claimed: 2016-12-23
- Assignees: Actron Technology Corporation
- Applicants: Actron Technology Corporation
- Inventors: Chi-Kai Wu
- Web page: https://patentgrep.com/patent/US10371724B2

## CPC

- G01R 19/16523: {using diodes, e.g. Zener diodes}
- G01K 7/01: using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence)
- G01K 15/007: {Testing}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/07637: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A rectifier package module for a vehicle and a connection status detection method for a temperature sensor thereof are provided. The rectifier package module includes at least one temperature sensor and a control chip. The control chip has an end coupled to the temperature sensor through a bonding wire. The control chip generates a current and provides a reference voltage according to a mode selection signal. The current is provided to the temperature sensor through the bonding wire. The control chip compares a voltage on the end with the reference voltage to generate a comparison result. In a test mode, a comparison circuit generates the comparison result to indicate a connection status between the end and the temperature sensor.

## Claims

### Claim 1

A rectifier package module for a vehicle, comprising:
at least one temperature sensor; and
a control chip having an end coupled to the at least one temperature sensor through at least one bonding wire, wherein the control chip generates a current and provides a reference voltage according to a mode selection signal, the current is provided to the at least one temperature sensor through the at least one bonding wire to generate a voltage on an end of the at least one bonding wire, and the control chip compares the voltage on the end with the reference voltage to generate a comparison result,
wherein in a test mode, the comparison result indicates whether the at least one temperature sensor is well connected to the control chip or not.

### Claim 2 (depends on 1)

The rectifier package module for the vehicle according to claim 1, wherein the current comprises a first current or a second current having different current values, and the reference voltage comprises a first voltage or a second voltage having different voltage values, wherein the control chip comprises:
a current generator generating the first current or the second current according to the mode selection signal;
a reference voltage generator providing the first voltage or the second voltage as the reference voltage according to the mode selection signal; and
a comparison circuit coupled to the current generator and the reference voltage generator and comparing the voltage on the end with the reference voltage to generate the comparison result.

### Claim 3 (depends on 2)

The rectifier package module for the vehicle according to claim 2, wherein:
in the test mode, the current generator provides the first current to the at least one temperature sensor and the reference voltage generator selects the first voltage as the reference voltage; and
in a normal mode, the current generator provides the second current to the at least one temperature sensor, and the reference voltage generator selects the second voltage as the reference voltage, and the comparison circuit generates the comparison result to indicate a relationship between an ambient temperature and a temperature threshold value.

### Claim 4 (depends on 3)

The rectifier package module for the vehicle according to claim 3, wherein the at least one temperature sensor provides a conductive voltage drop according to the ambient temperature, and the at least one temperature sensor comprises:
at least one diode having an anode coupled to the end and a cathode coupled to a reference ground end.

### Claim 5 (depends on 1)

The rectifier package module for the vehicle according to claim 1, further comprising:
a lead frame, wherein the at least one temperature sensor and the control chip are respectively disposed on different regions of a first surface of the lead frame; and
a plurality of transistors disposed on the first surface of the lead frame to form at least one rectifier bridge,
wherein the at least one temperature sensor and the transistors are disposed adjacent to each other.

### Claim 6 (depends on 5)

The rectifier package module for the vehicle according to claim 5, wherein the lead frame comprises at least one external lead pin, and the control chip is coupled to the at least one external lead pin and transmits the comparison result through the at least one external lead pin.

### Claim 7 (depends on 6)

The rectifier package module for the vehicle according to claim 6, further comprising:
a diode disposed between adjacent two external lead pins of the lead frame, wherein the control chip electrically connects a power pin of the lead frame to an anode of the diode and couples a cathode of the diode to a power receiving end of the control chip through a plurality of power transmission wires.

### Claim 8 (depends on 5)

The rectifier package module for the vehicle according to claim 5, further comprising:
a plurality of Zener diodes disposed on a second surface of the lead frame, wherein the first surface is opposite to the second surface and the Zener diodes are respectively connected in series between first ends and second ends of the transistors,
wherein the transistors comprise a metal oxide semiconductor field effect transistor.

### Claim 9

A connection status detection method for a temperature sensor in a rectifier package module for a vehicle, wherein the temperature sensor is coupled to an end of the rectifier package module through at least one bonding wire, the connection status detection method comprising:
generating a current according to a mode selection signal, wherein the current is provided to the temperature sensor through the at least one bond wire to generate a voltage on an end of the at least one bond wire;
providing a reference voltage according to the mode selection signal; and
comparing the voltage on the end with the reference voltage to generate a comparison result, wherein in a test mode, the comparison result indicates whether a the temperature sensor is well connected to the control chip or not.

### Claim 10 (depends on 9)

The connection status detection method according to claim 9, wherein the current comprises a first current or a second current having different current values, and the reference voltage comprises a first voltage or a second voltage having different voltage values, and the step of providing the reference voltage comprises: selecting one of the first voltage and the second voltage as the reference voltage according to the mode selection signal, wherein:
in the test mode, the first current is provided to the temperature sensor and the first voltage is selected as the reference voltage; and
in a normal mode, the second current is provided to the temperature sensor and the second voltage is selected as the reference voltage, wherein the comparison result indicates a relationship between an ambient temperature and a temperature threshold value.

### Claim 11 (depends on 10)

The connection status detection method according to claim 10, wherein:
the first current and the second current are generated at different times, and the current value of the first current is smaller than the current value of the second current;
the voltage value of the first voltage is greater than the voltage value of second voltage;
in the test mode, when the voltage on the end is greater than the reference voltage, the comparison result indicates that the end and the temperature sensor are disconnected; and
in the normal mode, when the voltage on the end is smaller than the reference voltage, the comparison result indicates that the ambient temperature is greater than the temperature threshold value.