# US 10,371,578 B2 · Thermal management of thermal sensor in a mobile device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,371,578 B2 - Document ID: US10371578B2 - Status: Granted - Kind: B2 - Application number: 14/865,641 - Filed: 2015-09-25 - Published: 2016-10-20 - Granted: 2019-08-06 - Earliest claimed: 2015-04-14 - Assignees: Maxim Integrated Products, Inc. - Applicants: Maxim Integrated Products, Inc. - Inventors: Arvin Emadi; Jerome C. Bhat - Web page: https://patentgrep.com/patent/US10371578B2 ## CPC - G01J 5/12: using thermoelectric elements, e.g. thermocouples - G01J 5/0816: {using attenuators} - G01J 5/0881: {Compact construction} - G01J 5/16: Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) ## Abstract A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system. ## Claims ### Claim 1 A mobile thermal sensor system, comprising: a thermal detector package including a first thermopile, a second thermopile, a reference temperature detector, and a package substrate configured to support the first thermopile, the second thermopile and the reference temperature detector; a substrate having first and second opposing sides and configured to support the thermal detector package on the first side of the substrate; and a heat spreader coupled to the second side of the substrate. ### Claim 2 (depends on 1) The mobile thermal sensor system of claim 1, wherein the substrate includes a printed circuit board. ### Claim 3 (depends on 1) The mobile thermal sensor system of claim 1, wherein the substrate includes a flexible circuit board. ### Claim 4 (depends on 1) The mobile thermal sensor system of claim 1, wherein the heat spreader includes at least one of aluminum, silicon, or copper. ### Claim 5 (depends on 1) The mobile thermal sensor system of claim 1, wherein the heat spreader includes at least one of carbon, graphite, carbon nanotubes, or carbon nano-fibers. ### Claim 6 (depends on 1) The mobile thermal sensor system of claim 1, wherein the heat spreader includes a first thermally conductive layer; a thermally insulating layer, and a second thermally conductive layer, wherein the thermally insulating layer is disposed between the first thermally conductive layer and the second thermally conductive layer. ### Claim 7 (depends on 6) The mobile thermal sensor system of claim 6, wherein the thermally insulating layer includes at least one of a gaseous medium or a porous medium. ### Claim 8 (depends on 7) The mobile thermal sensor system of claim 7, wherein the gaseous medium includes air. ### Claim 9 A mobile device case, comprising: a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system including a thermal detector package including a first thermopile, a second thermopile, a reference temperature detector, and a package substrate configured to support the first thermopile, the second thermopile and the reference temperature detector; and a substrate having first and second opposing sides and configured to support the thermal detector package on the first side of the substrate; a first heat spreader coupled to the second side of the substrate; an opening in the case; and a second heat spreader disposed on the case and proximate to the opening, where the second heat spreader is configured to contact the mobile thermal sensor system and disperse heat. ### Claim 10 (depends on 9) The mobile device case of claim 9, wherein the substrate includes a flexible circuit board. ### Claim 11 (depends on 9) The mobile device case of claim 9, wherein at least one of the first heat spreader or the second heat spreader includes at least one of aluminum, silicon, or copper. ### Claim 12 (depends on 9) The mobile device case of claim 9, wherein at least one of the first heat spreader or the second heat spreader includes at least one of carbon, graphite, carbon nanotubes, or carbon nano-fibers. ### Claim 13 (depends on 9) The mobile device case of claim 9, wherein the first heat spreader includes a first thermally conductive layer; a thermally insulating layer, and a second thermally conductive layer, the thermally insulating layer disposed between the first thermally conductive layer and the second thermally conductive layer, and wherein the thermally insulating layer includes at least one of a gaseous medium. ### Claim 14 (depends on 13) The mobile device case of claim 13, wherein the gaseous medium includes air. ### Claim 15 A process for fabricating a mobile thermal sensor system, comprising: reflowing a thermal detector package onto a first side of a substrate, where the thermal detector package includes at least a first thermopile, a second thermopile, a reference temperature detector and a package substrate configured to support the first thermopile, the second thermopile and the reference temperature detector; and attaching a heat spreader on a second side of the substrate, the first and second sides of the substrate being opposing sides of the substrate. ### Claim 16 (depends on 15) The process for fabricating the mobile thermal sensor system of claim 15, wherein placing the heat spreader on the substrate include placing at least one of an aluminum heat spreader or a copper heat spreader on the substrate.