# US 10,371,461 B2 · Multi-layered counterflow expanding microchannel cooling architecture and system thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,371,461 B2 - Document ID: US10371461B2 - Status: Granted - Kind: B2 - Application number: 15/290,748 - Filed: 2016-10-11 - Published: 2018-04-12 - Granted: 2019-08-06 - Earliest claimed: 2016-10-11 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Timothy Joseph Chainer; Pritish Ranjan Parida; Fanghao Yang - Web page: https://patentgrep.com/patent/US10371461B2 ## CPC - F28F 3/086: {having one or more openings therein forming tubular heat-exchange passages} - F28D 15/00: Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/025: {having non-capillary condensate return means} - F28D 15/0258: {with means to remove contaminants, e.g. getters} - F28D 15/0266: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)} - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - H05K 7/20309: {Evaporators} - H10W 40/73: for cooling by change of state - F28D 1/0341: {with U-flow or serpentine-flow inside the conduits} - F28D 2021/0028: {for cooling heat generating elements, e.g. for cooling electronic components or electric devices} - H10W 40/251: {Organics} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area. ## Claims ### Claim 1 A device, comprising: a plate having an inlet port; a first structure adjacent the plate and having a first inlet channel that receives fluid from the inlet port and feeds a first cooling channel, wherein a width of the first cooling channel increases linearly from the first inlet channel to an outlet channel on the first structure; and a second structure adjacent the first structure and having a second inlet channel that receives the fluid from the inlet port and feeds a second cooling channel, wherein a width of the second cooling channel increases linearly from the second inlet channel to a second outlet channel, wherein the first outlet channel is located at a first side of a heat transfer area of the device and the second outlet channel is located at a second side of the heat transfer area, wherein the first side is opposite the second side. ### Claim 2 (depends on 1) The device of claim 1, wherein a flow of the fluid on the first structure and the second structure are in counter flow directions, and wherein the first structure has a plurality of first cooling channels. ### Claim 3 (depends on 2) The device of claim 2, wherein the second structure has a plurality of second cooling channels. ### Claim 4 (depends on 1) The device of claim 1, further comprising: a third structure having a third cooling channel, wherein a third value of width of the third cooling channel increases as the third cooling channel extends from the first side of the heat transfer area towards the second side of the heat transfer area. ### Claim 5 (depends on 1) The device of claim 1, wherein the first cooling channel has a triangular shape. ### Claim 6 A device, comprising: a first manifold having a first cooling channel, wherein a width of the first cooling channel increases linearly from an inlet channel of the first manifold to an outlet channel of the first manifold, wherein the inlet channel is located on a first side of a heat transfer area at a first edge of the first manifold and the outlet channel is located on a second side of the heat transfer area at a second edge of the first manifold, wherein the first side is opposite the second side; a second manifold having a second cooling channel, wherein a width of the second cooling channel increases as the second cooling channel increases linearly from a second inlet channel to a second outlet channel, wherein a fluid that feeds through the first cooling channel is in a counter flow direction from the fluid through the second cooling channel; and wherein the first manifold traverses a first plane and the second manifold traverses a second plane, and wherein the first plane is parallel to the second plane. ### Claim 7 (depends on 6) The device of claim 6, wherein the first manifold has a plurality of first cooling channels. ### Claim 8 (depends on 7) The device of claim 7, wherein the second manifold has a plurality of second cooling channels. ### Claim 9 (depends on 6) The device of claim 6, wherein the first manifold is adjacent to the second manifold. ### Claim 10 (depends on 6) The device of claim 6, further comprising: a third manifold having a third cooling channel, wherein a width of the third cooling channel increases as the third cooling channel extends from the first side of the heat transfer area towards the second side of the heat transfer area. ### Claim 11 (depends on 6) The device of claim 6, wherein the first cooling channel and the second cooling channel are triangular in shape. ### Claim 12 A system, comprising: a pump that propels a fluid into a manifold device, wherein the manifold device comprises: a plate having an inlet port; a first manifold having a first inlet channel that receives fluid from the inlet port and outputs the fluid to a first cooling channel, wherein a width of the first cooling channel increases linearly from the first inlet channel to an outlet channel on the first manifold and a second manifold having a second inlet channel that receives the fluid and outputs the fluid to a second cooling channel, wherein a width of the second cooling channel increases from the second inlet channel to a second outlet channel, wherein the first inlet channel is located at a first side of a heat transfer area and the second inlet channel is located at a second side of the heat transfer area, wherein the first side of the heat transfer area is opposite the second side of the heat transfer area; and a reservoir that collects the fluid exiting the manifold device; a plate having an inlet port; a first structure adjacent the plate and having a first inlet channel that receives fluid from the inlet port and feeds a first cooling channel, wherein a width of the first cooling channel increases linearly from the first inlet channel to an outlet channel on the first structure; and a second structure adjacent the first structure and having a second inlet channel that receives the fluid from the inlet port and feeds a second cooling channel, wherein a width of the second cooling channel increases linearly from the second inlet channel to a second outlet channel, wherein the first outlet channel is located at a first side of a heat transfer area of the device and the second outlet channel is located at a second side of the heat transfer area, wherein the first side is opposite the second side. ### Claim 13 (depends on 12) The system of claim 12, further comprising: a condenser that condenses the fluid exiting the manifold device. ### Claim 14 (depends on 12) The system of claim 12, wherein the pump propels the fluid into the manifold device through an inlet port positioned at a side of the manifold device. ### Claim 15 (depends on 14) The system of claim 14, wherein the inlet port is outside the heat transfer area. ### Claim 16 (depends on 12) The system of claim 12, wherein the pump propels the fluid to flow through the heat transfer area in multiple directions.