# US 10,371,357 B2 · Electronic component and corresponding mounting method

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- Number: US 10,371,357 B2
- Document ID: US10371357B2
- Status: Granted
- Kind: B2
- Application number: 14/937,981
- Filed: 2015-11-11
- Published: 2016-05-12
- Granted: 2019-08-06
- Earliest claimed: 2014-11-12
- Assignees: OSRAM GmbH
- Applicants: OSRAM GmbH
- Inventors: Franco Zanon; Alessio Griffoni
- Web page: https://patentgrep.com/patent/US10371357B2

## CPC

- F21V 19/0025: {the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections}
- H10H 20/8585: {being an interconnection}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3431: {Leadless components}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/10106: Light emitting diode [LED]
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion. The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.

## Claims

### Claim 1

An electronic component comprising electrical contact pads for soldering onto a mounting board, the electrical contact pads arranged over a soldering area having a central portion and a peripheral portion surrounding the central portion, wherein the electrical contact pads comprise:
at least one first electrical contact pad at the central portion of the soldering area and at a center portion of the electronic component, and
at least one second electrical contact pad at the peripheral portion of the soldering area,
wherein the at least one second electrical contact pad is horseshoe-shaped and encircles at least in part the at least one first electrical contact pad; and
wherein a radial extension of the at least one first electrical contact pad at the central portion of the soldering area extends over the peripheral portion of the soldering area and a distal portion of the at least one second electrical contact pad overhangs or protrudes towards the radial extension of the at least one first electrical contact pad and faces inward with respect to the horseshoe-shape.

### Claim 2 (depends on 1)

The electronic component of claim 1, wherein said contact pads occupy at least 50%, of said first and second electrical soldering area.

### Claim 3 (depends on 1)

The electronic component of claim 1, wherein said at least one first electrical contact pad and said at least one second electrical contact pad are a cathode contact pad and an anode contact pad, respectively.

### Claim 4 (depends on 1)

The electronic component of claim 1, wherein the electronic component includes a solid state light radiation source.

### Claim 5 (depends on 1)

The electronic component of claim 1, wherein said first and second electrical contact pads occupy at least 70% of said soldering area.

### Claim 6 (depends on 1)

The electronic component of claim 1, wherein said first and second electrical contact pads occupy at least 90% of said soldering area.

### Claim 7 (depends on 1)

The electronic component of claim 1, wherein the electronic component includes a LED light radiation source.

### Claim 8 (depends on 1)

The electronic component of claim 1, wherein a width of the radial extension of the at least one first electrical contact pad at the peripheral portion is narrower than a width of the at least one first electrical contact pad located at the central portion.