# US 10,371,345 B2 · Light emitting diode (LED) module for LED luminaire > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,371,345 B2 - Document ID: US10371345B2 - Status: Granted - Kind: B2 - Application number: 15/388,907 - Filed: 2016-12-22 - Published: 2017-06-29 - Granted: 2019-08-06 - Earliest claimed: 2015-12-28 - Assignees: Eaton Intelligent Power Limited - Applicants: Eaton Intelligent Power Limited - Inventors: Christopher D. Nolan; Joseph R. Casper; Walten Peter Owens; Joseph J. Witkowski - Web page: https://patentgrep.com/patent/US10371345B2 ## CPC - F21V 3/00: Globes; Bowls; Cover glasses (with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506) - F21S 2/005: {of modular construction} - F21V 15/01: Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) - F21V 21/30: Pivoted housings or frames - F21V 23/06: the elements being coupling devices {, e.g. connectors} - F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) - F21V 29/507: of means for protecting lighting devices from damage, e.g. housings - F21V 29/508: of electrical circuits - F21V 29/74: with fins or blades - F21V 29/85: characterised by the material (liquid coolants F21V29/56) - F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor - F21W 2131/105: of arenas or the like - F21Y 2113/00: Combination of light sources - F21Y 2115/10: Light-emitting diodes [LED] - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - F21W: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A light emitting diode (LED) module for a light fixture includes a substrate with an upper surface and a lower surface. Various pressure multiplying pads are integrally connected to the lower surface, and each pressure multiplying pad extends away from the lower surface. LEDs are attached to the upper surface, along with a set of conductive lines so that each conductive line electrically connects a corresponding LED to a power inputs. Each of the pressure multiplying pads may be positioned opposite a corresponding LED. A flexible lens cover may cover the upper surface and the LEDs, while leaving the lower surface and pressure multiplying pads exposed so that the pads can contact a heat sink of the light fixture. ## Claims ### Claim 1 A light emitting diode (LED) module for an LED light fixture comprising: a substrate that comprises: an upper surface, a lower surface, at least one power input, and a plurality of pressure multiplying pads, each of which is integrally connected to a portion of the lower surface and extending away from the lower surface, and wherein the pressure multiplying pads are arranged so that a portion of the lower surface does not have any of the pressure multiplying pads connected to it; a plurality of LEDs positioned over the upper surface; and a plurality of conductive lines positioned so that each conductive line electrically connects a corresponding LED to at least one of the power inputs. ### Claim 2 (depends on 1) The LED module of claim 1, wherein the LED module is coated with a parylene material. ### Claim 3 (depends on 1) The LED module of claim 1, wherein each of the pressure multiplying pads is positioned under a corresponding LED. ### Claim 4 (depends on 3) The LED module of claim 3, wherein each of the pressure multiplying pads extends beyond a lower surface of any sidewall of the substrate. ### Claim 5 (depends on 1) The LED module of claim 1, wherein: the LED module is included within a light fixture comprising a heat sink body; and the LED module is positioned within an opening of the heat sink body. ### Claim 6 (depends on 5) The LED module of claim 5, wherein the LED module is at least partially coated with a parylene material so that the parylene material is a part of the pressure multiplying pads and provides a thermal transfer function between the pressure multiplying pads and the heat sink body. ### Claim 7 (depends on 1) The LED module of claim 1, further comprising: a ridge positioned around a perimeter of the substrate; and a flexible lens cover shaped to fit over the upper surface and around the ridge while leaving at least a portion of the lower surface exposed. ### Claim 8 (depends on 1) The LED module of claim 1, further comprising a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the upper surface so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate. ### Claim 9 (depends on 8) The LED module of claim 8, wherein the layer is selectively positioned under the LEDs and the conductive lines so that the layer does not fully cover the substrate. ### Claim 10 (depends on 1) The LED module of claim 1, wherein the pressure multiplying pads are formed together as a single structure. ### Claim 11 (depends on 1) The LED module of claim 1, wherein each of the pressure multiplying pads extends inward from a position proximate an outer edge of the substrate. ### Claim 12 A light emitting diode (LED) module for an LED light fixture comprising: a substrate that comprises: an upper surface, a lower surface, a plurality of pressure multiplying pads, each of which is integrally connected to a portion of the lower surface and extending away from the lower surface, and wherein the pressure multiplying pads are arranged so that a portion of the lower surface does not have any of the pressure multiplying pads connected to it; a plurality of LEDs positioned over the upper surface; a plurality of conductive lines positioned so that each conductive line electrically connects a corresponding LED to a power input; and a flexible lens cover shaped to fit over the upper surface while leaving at least a portion of the lower surface exposed. ### Claim 13 (depends on 12) The LED module of claim 12, wherein the substrate is at least partially coated with a parylene material. ### Claim 14 (depends on 12) The LED module of claim 12, wherein each of the pressure multiplying pads is positioned under a corresponding LED. ### Claim 15 (depends on 14) The LED module of claim 14, wherein each of the pressure multiplying pads extends beyond a lower surface of any sidewall of the substrate. ### Claim 16 (depends on 12) The LED module of claim 12, wherein: the LED module is included within a light fixture comprising a heat sink body; and the LED module is positioned within an opening of the heat sink body. ### Claim 17 (depends on 16) The LED module of claim 16, wherein the LED module is at least partially coated with a parylene material so that the parylene material is a part of the pressure multiplying pads and provides a thermal transfer function between the pressure multiplying pads and the heat sink body. ### Claim 18 (depends on 12) The LED module of claim 12, further comprising: a ridge positioned around a perimeter of the substrate; and the flexible lens cover is shaped to fit over the upper surface and around the ridge. ### Claim 19 (depends on 12) The LED module of claim 12, further comprising a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the upper surface so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate. ### Claim 20 (depends on 19) The LED module of claim 19, wherein the layer is selectively positioned under the LEDs and the conductive lines so that the layer does not fully cover the substrate. ### Claim 21 (depends on 12) The LED module of claim 12, wherein the pressure multiplying pads are formed together as a single structure. ### Claim 22 (depends on 12) The LED module of claim 12, wherein each of the pressure multiplying pads extends inward from a position proximate an outer edge of the substrate.