# US 10,370,623 B2 · Cleaner composition and preparation of thin substrate

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- Number: US 10,370,623 B2
- Document ID: US10370623B2
- Status: Granted
- Kind: B2
- Application number: 15/488,786
- Filed: 2017-04-17
- Published: 2017-10-26
- Granted: 2019-08-06
- Earliest claimed: 2016-04-26
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Masaya Ueno; Hideyoshi Yanagisawa
- Web page: https://patentgrep.com/patent/US10370623B2

## CPC

- C09J 183/04: Polysiloxanes
- C11D 7/261: {Alcohols; Phenols}
- C11D 7/3209: {Amines or imines with one to four nitrogen atoms; Quaternized amines}
- C11D 7/5004: {Organic solvents}
- C11D 7/5022: {containing oxygen}
- C11D 7/5027: {Hydrocarbons}
- H10P 50/283: {by chemical means}
- H10P 50/287: {by chemical means}
- H10P 70/20: {Cleaning during device manufacture}
- H10P 70/56: {Cleaning of wafer backside}
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 90/123: {by grinding or lapping}
- C08G 77/16: to hydroxy groups
- C11D 2111/22: Electronic devices, e.g. PCBs or semiconductors
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C11D: DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

## Claims

### Claim 1

A cleaner composition for removing any silicone adhesive remaining on a substrate, consisting essentially of
(A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
(B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
(C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.

### Claim 2 (depends on 1)

The cleaner composition of claim 1 wherein component (C) is tetrabutylammonium hydroxide.

### Claim 3 (depends on 1)

The cleaner composition of claim 1 wherein the substrate is a semiconductor substrate.

### Claim 4 (depends on 1)

The cleaner composition of claim 1, wherein the alcohol (B) is one or more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol, and 2-ethyl-1-butanol.

### Claim 5

A method for preparing a thin substrate, comprising the steps of
(a) forming an adhesive layer on a substrate or handle substrate from an adhesive composition and bonding the substrate and the handle substrate via the adhesive layer,
(b) processing the substrate bonded to the handle substrate,
(c) separating the substrate as processed from the handle substrate, the adhesive layer remaining on the substrate after separation, and
(d) cleaning away the adhesive layer on the substrate with the cleaner composition, wherein the cleaner composition consisting essentially of
(A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
(B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
(C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.

### Claim 6 (depends on 5)

The method of claim 5 wherein the adhesive composition comprises a silicone compound.

### Claim 7 (depends on 6)

The method of claim 6 wherein the silicone compound is a (partial) dehydration condensate of a linear or branched organopolysiloxane having at least two silicon-bonded hydroxyl groups with an organopolysiloxane resin comprising R3SiO1/2 units wherein R is a monovalent hydrocarbon group and SiO2 units and containing a hydroxyl group.