# US 10,370,573 B2 · Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet

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- Number: US 10,370,573 B2
- Document ID: US10370573B2
- Status: Granted
- Kind: B2
- Application number: 14/403,122
- Filed: 2013-05-17
- Published: 2015-04-23
- Granted: 2019-08-06
- Earliest claimed: 2012-05-21
- Assignees: Toyo Ink Sc Holdings Co., Ltd.
- Applicants: Toyo Ink Sc Holdings Co., Ltd.
- Inventors: Kaori Sakaguchi; Taiki Sakamoto; Atsushi Nakazato; Takanori Itoh; Takahiro Matsuzawa; Daisuke Kishi
- Web page: https://patentgrep.com/patent/US10370573B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- C01B 21/064: with boron
- C01B 21/072: with aluminium
- C09J 7/10: without carriers
- C09J 9/00: Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence)
- C09J 11/04: inorganic
- H10W 40/251: {Organics}
- C08K 7/18: inorganic
- C08K 9/08: Ingredients agglomerated by treatment with a binding agent
- C09J 2301/408: additives as essential feature of the adhesive layer
- H10W 40/25: characterised by their materials
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- Y10T 428/1405: Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]
- Y10T 428/2982: Particulate matter [e.g., sphere, flake, etc.]
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An object of the present invention is to provide a thermal conductivity-giving material capable of giving substantially the same level of a thermal conductivity as that of the conventional material by using a smaller amount thereof than that conventionally used or giving a higher thermal conductivity than that of the conventional material by using substantially the same amount thereof as that conventionally used. The aforementioned problem can be solved by an easily deformable aggregate (D) comprising 100 pts·mass of thermally conductive particles (A) having an average primary particle diameter of 0.1 to 10 μm, and 0.1 to 30 pts·mass of an organic binding agent (B), in which the easily deformable aggregate (D) has an average particle diameter of 2 to 100 μm, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower.

## Claims

### Claim 1

A thermally-conductive, electrically-insulating member (H) manufactured by a manufacturing method, the thermally-conductive electrically-insulating member (H) comprising a thermally conductive layer comprising:
(1) 20 to 90 vol. % of an easily deformable aggregate (D) comprising:
(i) 100 pts·mass of thermally-conductive, electrically-insulating particles (A) having an average primary particle diameter of 0.1 to 10 μm; and
(ii) 0.1 to 30 pts·mass of an organic binding agent (B) not including a silane coupling agent,
wherein the easily deformable aggregate (D) has an average particle diameter of 2 to 100 μm, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower; and
(2) 10 to 80 vol. % of a binder resin (E),
the manufacturing method comprising:
a step of obtaining a slurry comprising 100 pts·mass of thermally-conductive, electrically-insulating particles (A) having an average primary particle diameter of 0.1 to 10 μm, 0.1 to 30 pts·mass of an organic binding agent (B), and a solvent (C) that dissolves the agent (B);
a step of removing the solvent (C) from the obtained slurry to obtain an easily deformable aggregate (D);
a step of preparing a thermally conductive resin composite (G) comprising an easily deformable aggregates (D), a binder resin (E); and a solvent (F) that dissolves the binder resin (E);
a step of applying the thermally conductive resin composition (G) on a base material and thereby forming a coating; and
a step of removing the solvent (F) from the coating and thereby forming a thermally conductive layer.

### Claim 2 (depends on 1)

The thermally-conductive, electrically-insulating member (H) according to claim 1, wherein a ratio of an average particle diameter of the easily deformable aggregates (D) to a thickness of the thermally conductive layer is equal to or greater than 20%.

### Claim 3 (depends on 1)

A thermally-conductive, electrically-insulating member (I) formed by applying a pressure on a thermally-conductive, electrically-insulating member (H) according to claim 1.

### Claim 4 (depends on 1)

A thermally conductive adhesive sheet comprising a thermally conductive member (H) according to claim 1, wherein
the thermally conductive adhesive sheet further comprises a release film disposed on at least one surface thereof.

### Claim 5 (depends on 3)

A thermally-conductive adhesive sheet comprising a thermally-conductive, electrically-insulating member (I) according to claim 3, wherein the thermally-conductive adhesive sheet further comprises a release film disposed on at least one surface thereof.