# US 10,370,536 B2 · Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,370,536 B2 - Document ID: US10370536B2 - Status: Granted - Kind: B2 - Application number: 15/118,302 - Filed: 2015-02-19 - Published: 2017-06-08 - Granted: 2019-08-06 - Earliest claimed: 2014-03-06 - Assignees: Mitsubishi Gas Chemical Company, Inc. - Applicants: Mitsubishi Gas Chemical Company, Inc. - Inventors: Yoshitaka Ueno; Masataka Kudo; Michio Yaginuma - Web page: https://patentgrep.com/patent/US10370536B2 ## CPC - C08L 71/126: {modified by chemical after-treatment} - B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} - B32B 15/08: of synthetic resin - B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} - B32B 27/20: using fillers, pigments, thixotroping agents - C08J 5/244: {using glass fibres} - C08J 5/249: {characterised by the additives used in the prepolymer mixture} - C08K 3/36: Silica - C08K 5/5399: Phosphorus bound to nitrogen - C08K 7/18: inorganic - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08L 71/12: Polyphenylene oxides - H05K 1/0346: {containing N} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - B32B 2262/101: Glass fibres - B32B 2307/202: Conductive - B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant - B32B 2457/00: Electrical equipment - B32B 2457/08: PCBs, i.e. printed circuit boards - C08G 73/0655: {from polycyanurates} - C08J 2371/12: Polyphenylene oxides - C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors - C08L 2203/20: use in electrical or conductive gadgets - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K 2201/0209: Inorganic, non-metallic particles - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ## Abstract A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E). ## Claims ### Claim 1 A resin composition comprising: a polyphenylene ether (A) having a number average molecular weight of 500 to 5000 and comprising a compound represented by the following formula (4): wherein X represents a group represented by the following formula (5) or the following formula (6), Y each independently represents a group represented by the following formula (7), a and b each represent an integer of 0 to 100, and at least either one of a and b is 1 or more, wherein R21, R22, R23, R27,and R28 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R24, R25, and R26 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, wherein R29, R30, R31, R32, R33, R34, R35, and R36 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and A represents a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms, wherein R39 and R40 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R37 and R38 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group; a cyclophosphazene compound (B) represented by the following formula (13); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E), wherein Z1 and Z2 each independently represents a vinyl group or a hydrogen atom, at least either one of Z1 and Z2 is a vinyl group, and n represents an integer of 3 to 8 and wherein a ratio of the vinyl group equivalent of the cyclophosphazene compound (B) to the vinyl group equivalent of the polyphenylene ether (A) is from 0.2 to 4. ### Claim 2 (depends on 1) The resin composition according to claim 1 , wherein a content of the polyphenylene ether (A) is 40 to 80 parts by mass based on 100 parts by mass of a total of the (A) to (D) components. ### Claim 3 (depends on 1) The resin composition according to claim 1 , wherein a content of the cyclophosphazene compound (B) is 10 to 30 parts by mass based on 100 parts by mass of the total of the (A) to (D) components. ### Claim 4 (depends on 1) The resin composition according to claim 1 , wherein the non-halogen-based epoxy resin (C) comprises any one or more selected from the group consisting of a naphthalene-modified epoxy resin, a cresol novolac-based epoxy resin, and a bisphenol A-based epoxy resin. ### Claim 5 (depends on 1) The resin composition according to claim 1 , wherein a content of the non-halogen-based epoxy resin (C) is 2 to 20 parts by mass based on 100 parts by mass of the total of the (A) to (D) components. ### Claim 6 (depends on 1) The resin composition according to claim 1 , wherein the cyanate compound (D) comprises a bisphenol A-based cyanate compound and/or a naphthol aralkyl-based cyanate compound. ### Claim 7 (depends on 1) The resin composition according to claim 1 , wherein a content of the cyanate compound (D) is 5 to 30 parts by mass based on 100 parts by mass of the total of the (A) to (D) components. ### Claim 8 (depends on 1) The resin composition according to claim 1 , wherein a content of the filler (E) is 20 to 150 parts by mass based on 100 parts by mass of the total of the (A) to (D) components. ### Claim 9 (depends on 1) The resin composition according to claim 1 , wherein the filler (E) comprises a silica. ### Claim 10 (depends on 1) The resin composition according to claim 1 , for use in a prepreg, a metal foil-clad laminate, a single-layer resin sheet, a laminated resin sheet, or a printed wiring board for in-vehicle use. ### Claim 11 (depends on 1) A prepreg comprising: a base material; and the resin composition according to claim 1 with which the base material is impregnated or coated. ### Claim 12 (depends on 11) A metal foil-clad laminate comprising: a laminate of one or more of the prepregs according to claim 11; and metal foil laminate-molded on one surface or both surfaces of the laminate. ### Claim 13 (depends on 1) A single-layer resin sheet obtained by molding the resin composition according to claim 1 into a sheet shape. ### Claim 14 (depends on 1) A laminated resin sheet comprising: a sheet base material; and the resin composition according to claim 1 applied and dried on one surface or both surfaces of the sheet base material. ### Claim 15 (depends on 1) A printed wiring board comprising: an insulating layer; and a conductor layer formed on one surface or both surfaces of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1.