# US 10,370,509 B2 · Fiber-reinforced resin, process for producing same, and molded article

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- Number: US 10,370,509 B2
- Document ID: US10370509B2
- Status: Granted
- Kind: B2
- Application number: 15/759,976
- Filed: 2016-10-05
- Published: 2018-09-13
- Granted: 2019-08-06
- Earliest claimed: 2015-10-07
- Assignees: Daicel-Evonik Ltd.
- Applicants: Daicel-Evonik Ltd.
- Inventors: Mitsuteru Mutsuda; Yoshiki Nakaie; Takayuki Uno
- Web page: https://patentgrep.com/patent/US10370509B2

## CPC

- C08J 5/042: {with carbon fibres}
- B29B 11/16: comprising fillers or reinforcement {(non-woven fabrics per se D04H1/00, D04H3/00)}
- C08G 59/1472: {Fatty acids}
- C08G 69/14: Lactams
- C08G 69/26: derived from polyamines and polycarboxylic acids
- C08J 3/12: Powdering or granulating
- C08J 5/10: characterised by the additives used in the polymer mixture
- C08J 5/24: Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J 5/243: {using carbon fibres}
- C08K 3/04: Carbon
- C08K 7/02: Fibres or whiskers
- C08K 7/04: inorganic
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L 71/02: Polyalkylene oxides
- C08L 77/00: Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers
- C08J 2300/24: Thermosetting resins
- C08J 2363/00: Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J 2377/00: Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- B29B: PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

## Claims

### Claim 1

A resin composition comprising (A) a reinforcing fiber, (B) a resin particle, and (C) a matrix resin, wherein
the reinforcing fiber (A) contains a carbon fiber, and
the resin particle (B) contains a semicrystalline thermoplastic resin, and the semicrystalline thermoplastic resin is a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C. and/or an aliphatic polyamide resin,
the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the exothermic peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and
the resin particle (B) has a spherical shape and an average particle size of 15 to 25 μm.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the semicrystalline thermoplastic resin is a polyamide resin having a melting point of not lower than 150° C.

### Claim 3 (depends on 1)

The resin composition according to claim 1, wherein the semicrystalline thermoplastic resin is a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%.

### Claim 4 (depends on 1)

The resin composition according to claim 1, wherein the resin particle (B) further comprises an impact modifier.

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the matrix resin (C) is a thermosetting resin.

### Claim 6 (depends on 1)

A molded article comprising a resin composition recited in claim 1.

### Claim 7

An additive for a composition comprising (A) a reinforcing fiber containing a carbon fiber and (C) a matrix resin to increase or improve a reinforcing effect of the reinforcing fiber (A),
wherein the additive comprises (B) a resin particle,
the resin particle (B) contains a semicrystalline thermoplastic resin, and the semicrystalline thermoplastic resin is a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C. and/or an aliphatic polyamide resin,
the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the exothermic peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and
the resin particle (B) has a spherical shape and an average particle size of 15 to 25 μm.