# US 10,370,496 B2 · Polyamic acid resin and polyamideimide film

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- Number: US 10,370,496 B2
- Document ID: US10370496B2
- Status: Granted
- Kind: B2
- Application number: 15/668,970
- Filed: 2017-08-04
- Published: 2018-02-15
- Granted: 2019-08-06
- Earliest claimed: 2016-08-11
- Assignees: SK Innovation Co., Ltd.
- Applicants: SK Innovation Co., Ltd.
- Inventors: Sang Yoon Park; Hyeon Jeong Kim; Tae Sug Jang; Jin Hyung Park
- Web page: https://patentgrep.com/patent/US10370496B2

## CPC

- C08G 73/14: Polyamide-imides
- C08G 73/1021: {characterised by the catalyst used}
- C08G 73/1039: {comprising halogen-containing substituents}
- C08G 73/1042: {Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds}
- C08G 73/1078: {wholly aromatic in the diamino moiety}
- C08J 5/18: Manufacture of films or sheets
- C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08J 2379/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)

## Abstract

Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, and a polyamideimide film capable of implementing high modulus and excellent optical properties.

## Claims

### Claim 1

A polyamideimide film comprising:
a polyamideimide resin derived from an aromatic diamine, wherein the aromatic diamine comprises 2,2′-bis(trifluoromethyl)-benzidine;
an acid anhydride comprising an aromatic dianhydride and a cycloaliphatic dianhydride; and
an aromatic diacid dichloride,
wherein
an amount of the aromatic diacid dichloride is more than 50 mol based on 100 mol of the aromatic diamine, and
a molar ratio between the aromatic diacid dichloride and the aromatic dianhydride ranges from 2.50 to 7.00.

### Claim 2 (depends on 1)

The polyamideimide film of claim 1, wherein the aromatic diacid dichloride includes any one or a mixture of two or more selected from the group consisting of terephthaloyl dichloride, isophthaloyl dichloride, 1,1′-biphenyl-4,4′-dicarbonyl dichloride, 1,4-naphthalene dicarboxylic dichloride, 2,6-naphthalene dicarboxylic dichloride, and 1,5-naphthalene dicarboxylic dichloride.

### Claim 3 (depends on 1)

The polyamideimide film of claim 1, wherein the aromatic dianhydride is 4,4′-hexafluoroisopropylidene diphthalic anhydride, and the cycloaliphatic dianhydride is cyclobutane tetracarboxylic dianhydride.

### Claim 4 (depends on 1)

The polyamideimide film of claim 1, wherein the aromatic diacid dichloride has a content of 55 to 90 mol with respect to 100 mol of the aromatic diamine.

### Claim 5 (depends on 1)

The polyamideimide film of claim 1, wherein the polyamideimide film has a modulus of 5.0 GPa or more, measured at an extension rate of 25 mm/min using UTM 3365 manufactured by Instron.

### Claim 6 (depends on 5)

The polyamideimide film of claim 5, wherein the polyamideimide film has a total light transmittance of 88% or more, and a Yellow index of 3.0 or less.

### Claim 7 (depends on 5)

The polyamideimide film of claim 5, wherein the polyamideimide film has a light transmittance of 60% or more, measured at 388 nm.

### Claim 8 (depends on 1)

The polyamideimide film of claim 1, wherein the polyamideimide film has a modulus of 5.0 GPa or more, measured at an extension rate of 25 mm/min using UTM 3365 manufactured by Instron, on a specimen having a thickness of 45 to 55 μm, a length of 50 mm, and a width of 10 mm.

### Claim 9 (depends on 8)

The polyamideimide film of claim 8, wherein the polyamideimide film has a total light transmittance of 88% or more, and a Yellow index of 3.0 or less, based on a thickness of 45 to 55 μm.

### Claim 10 (depends on 8)

The polyamideimide film of claim 8, wherein the polyamideimide film has a light transmittance of 60% or more, measured at 388 nm.

### Claim 11 (depends on 1)

An image display device comprising the polyamideimide film of claim 1.

### Claim 12

A polyamic acid resin derived from aromatic diamine, acid anhydride, and aromatic diacid dichloride,
wherein the aromatic diamine includes 2,2′-bis(trifluoromethyl)-benzidine,
the acid anhydride includes aromatic dianhydride and cycloaliphatic dianhydride,
the aromatic diacid dichloride has a content of more than 50 mol with respect to 100 mol of the aromatic diamine, and
a molar ratio between the aromatic diacid dichloride and the aromatic dianhydride ranges from 2.50 to 7.00.

### Claim 13

A polyamideimide film comprising:
a polyamideimide resin derived from an aromatic diamine, an acid anhydride, and an aromatic diacid dichloride,
wherein
the aromatic diamine comprises 2,2′-bis(trifluoromethyl)-benzidine,
the acid anhydride comprises an aromatic dianhydride and a cycloaliphatic dianhydride,
an amount of the aromatic diacid dichloride is more than 50 mol based on 100 mol of the aromatic diamine,
a total light transmittance of the polyamideimide film is 88% or more, and
a Yellow index of the polyamideimide film is 3.0 or less.

### Claim 14 (depends on 13)

The polyamideimide film of claim 13, wherein the total light transmittance and the Yellow index are based on a thickness ranging from 45 μm to 55 μm.
