# US 10,370,303 B2 · Process for producing bonded body and process for producing power module substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,370,303 B2 - Document ID: US10370303B2 - Status: Granted - Kind: B2 - Application number: 15/304,544 - Filed: 2015-04-16 - Published: 2017-02-16 - Granted: 2019-08-06 - Earliest claimed: 2014-04-25 - Assignees: Mitsubishi Materials Corporation - Applicants: Mitsubishi Materials Corporation - Inventors: Nobuyuki Terasaki; Yoshiyuki Nagatomo - Web page: https://patentgrep.com/patent/US10370303B2 ## CPC - C04B 37/026: {consisting of metals or metal salts} - B23K 1/00: Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) - B23K 1/19: taking account of the properties of the materials to be soldered - B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating - B23K 35/302: {Cu as the principal constituent} - C04B 35/645: Pressure sintering - C04B 37/02: with metallic articles - C22C 9/00: Alloys based on copper - C22C 9/01: with aluminium as the next major constituent - C22C 9/02: with tin as the next major constituent - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - B23K 35/26: with the principal constituent melting at less than 400°C - B23K 35/28: with the principal constituent melting at less than 950°C - B23K 35/30: with the principal constituent melting at less than 1550°C - C04B 2235/6567: Treatment time - C04B 2235/6581: Total pressure below 1 atmosphere, e.g. vacuum - C04B 2237/12: Metallic interlayers - C04B 2237/121: based on aluminium - C04B 2237/123: based on iron group metals, e.g. steel - C04B 2237/124: based on copper - C04B 2237/126: wherein the active component for bonding is not the largest fraction of the interlayer - C04B 2237/128: The active component for bonding being silicon - C04B 2237/343: Alumina or aluminates - C04B 2237/366: Aluminium nitride - C04B 2237/368: Silicon nitride - C04B 2237/402: Aluminium - C04B 2237/407: Copper - C04B 2237/55: Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer - C04B 2237/592: whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer - C04B 2237/704: of one or more of the ceramic layers or articles - C04B 2237/72: Forming laminates or joined articles comprising at least two interlayers directly next to each other - C22C 12/00: Alloys based on antimony or bismuth - C22C 13/00: Alloys based on tin - C22C 21/00: Alloys based on aluminium - C22C 24/00: Alloys based on an alkali or an alkaline earth metal - C22C 28/00: Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00 - C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - C22C: ALLOYS (treatment of alloys C21D, C22F) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together. ## Claims ### Claim 1 A process for producing a bonded body by bonding a ceramic member made of a ceramic and a Cu member made of Cu or a Cu alloy together, the process comprising: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material consisting of Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together, wherein the eutectic element is one element or two or more elements selected from Ca, Ge, Sr, Sn, Sb, Ba, La, Ce, and Al. ### Claim 2 (depends on 1) The process for producing a bonded body according to claim 1, wherein in the laminating step, the brazing material is disposed on the ceramic member, and the active metal is disposed on the Cu member. ### Claim 3 (depends on 1) The process for producing a bonded body according to claim 1, wherein in the laminating step, an Al member made of Al or an Al alloy is further laminated on a second surface side of the ceramic member, and wherein in the heating step, the ceramic member, the Cu member, and the Al member which are laminated together are heated. ### Claim 4 (depends on 1) The process for producing a bonded body according to claim 1, wherein the ceramic member is made of any one of Si3N4, AlN, or Al2O3. ### Claim 5 (depends on 1) A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate, wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 1. ### Claim 6 (depends on 2) The process for producing a bonded body according to claim 2, wherein in the laminating step, an Al member made of Al or an Al alloy is further laminated on a second surface side of the ceramic member, and wherein in the heating step, the ceramic member, the Cu member, and the Al member which are laminated together are heated. ### Claim 7 (depends on 2) The process for producing a bonded body according to claim 2, wherein the ceramic member is made of any one of Si3N4, AlN, or Al2O3. ### Claim 8 (depends on 3) The process for producing a bonded body according to claim 3, wherein the ceramic member is made of any one of Si3N4, AlN, or Al2O3. ### Claim 9 (depends on 6) The process for producing a bonded body according to claim 6, wherein the ceramic member is made of any one of Si3N4, AlN, or Al2O3. ### Claim 10 (depends on 2) A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate, wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 2. ### Claim 11 (depends on 3) A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate, wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 3. ### Claim 12 (depends on 4) A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate, wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 4.