# US 10,370,240 B2 · Layer structure and method of manufacturing a layer structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,370,240 B2 - Document ID: US10370240B2 - Status: Granted - Kind: B2 - Application number: 15/646,161 - Filed: 2017-07-11 - Published: 2018-01-18 - Granted: 2019-08-06 - Earliest claimed: 2016-07-12 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Matthias Koenig; Guenther Ruhl - Web page: https://patentgrep.com/patent/US10370240B2 ## CPC - B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers} - B81C 1/00158: {Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039)} - B81C 1/00476: {removing a sacrificial layer (B81C1/00912 takes precedence)} - B81B 2201/0257: Microphones or microspeakers - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - B81C 2201/0109: Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108 - B81C 2201/0187: Controlled formation of micro- or nanostructures using a template positioned on a substrate - B81C 2201/0197: Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192 - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract A layer structure may include a carrier, a two-dimensional layer, and a holding structure. The holding structure is arranged on the carrier and holds the two-dimensional layer on the carrier such that at least a portion of the two-dimensional layer is spaced apart from the carrier. The holding structure includes a holding portion extending from the two-dimensional layer towards the carrier beyond the at least a portion of the two-dimensional layer spaced apart from the carrier. ## Claims ### Claim 1 A layer structure, comprising: carrier; a two-dimensional layer comprising a first surface facing away from the carrier, a second surface opposite the first surface towards the carrier, and an edge surface; and a holding structure; wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the second surface of the two-dimensional layer is free of the holding structure and is spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises a contact portion contacting the first surface of the two-dimensional layer; wherein the holding structure comprises a holding portion arranged on the carrier beyond the edge surface of the two-dimensional layer such that the holding portion is not in contact with the second surface of the two two-dimensional layer and extends a distance between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises a holding pillar comprising the contact portion and the holding portion; and wherein the holding pillar is at least partially made of an electrically conductive material. ### Claim 2 (depends on 1) The layer structure of claim 1, wherein the two-dimensional layer is made of a layer material including at least one of graphene, a graphene-related material, transition metal dichalcogenide, phosphorene, silicene, germanene, graphane, germanane, fluorographene, and fluorographane. ### Claim 3 (depends on 1) The layer structure of claim 1, wherein the entirety of the two-dimensional layer is spaced apart from the carrier. ### Claim 4 (depends on 1) The layer structure of claim 1, wherein the contact portion further physically contacts the edge surface of the two-dimensional layer. ### Claim 5 (depends on 4) The layer structure of claim 4, wherein the contact portion is angled so that the holding pillar is substantially L-shaped. ### Claim 6 (depends on 1) The layer structure of claim 1, wherein the height of the holding pillar is in the range from about 500 nm to about 50 μm; wherein the ratio of a diameter of the two-dimensional layer to the height of the holding pillar is less than 20:1. ### Claim 7 (depends on 1) The layer structure of claim 1, wherein the holding pillar comprises at least two holding members being in physical contact with each other and having different thermal expansion characteristics; wherein each of the at least two holding members comprises an inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space; and wherein the outward surface of one of the at least two holding members is in physical contact with the inward surface of another of the at least two holding members. ### Claim 8 (depends on 7) The layer structure of claim 7, further comprising a heater arranged on the carrier adjacent to the holding pillar, the heater configured to heat the holding pillar. ### Claim 9 An array, comprising a plurality of layer structures, wherein the layer structure comprises, a carrier; a two-dimensional layer comprising a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface; and a holding structure; wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that at the second surface of the two-dimensional layer is free of the holding structure and is spaced apart from the carrier thereby forming an empty space between the carrier and the second of the two-dimensional layer; wherein the holding structure comprises a holding portion disposed beyond the edge surface of the two-dimensional layer such that the holding portion is not in contact with the second surface of the two-dimensional layer and spans a distance between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises a contact portion contacting the first surface of the two-dimensional layer; wherein the holding structure comprises a holding pillar comprising the contact portion and the holding portion; and wherein the holding pillar is at least partially made of an electrically conductive material. ### Claim 10 A layer structure, comprising: a carrier; a two-dimensional layer comprises a first surface facing away from the carrier, a second surface opposite the first surface towards the carrier, and an edge surface; and a holding structure; wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the first surface of the two-dimensional layer is in contact with the holding structure and the second surface of the two-dimensional layer is free of the holding structure and the two-dimensional layer is spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises at least two holding members being in physical contact with each other and having different thermal expansion characteristics; wherein each of the at least two holding members comprises an inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space; and wherein the outward surface of one of the at least two holding members is in physical contact with the inward surface of another one of the at least two holding members. ### Claim 11 (depends on 10) The layer structure of claim 10, wherein the two-dimensional layer is made of a layer material including at least one of graphene, a graphene-related material, transition metal dichalcogenide, phosphorene, silicene, germanene, graphane, germanane, fluorographene, and fluorographane. ### Claim 12 (depends on 11) The layer structure of claim 11, wherein the graphene-related material comprises at least one of 2D molybdenum sulphide, tungsten disulphide, and tungsten diselenide. ### Claim 13 (depends on 10) The layer structure of claim 10, wherein at least one of the holding members is made of an electrically conductive material. ### Claim 14 (depends on 10) The layer structure of claim 10, further comprising: a heater arranged on the carrier adjacent to the at least two holding members, the heater configured to heat the at least two holding members. ### Claim 15 (depends on 10) The layer structure of claim 10, wherein the holding structure comprises a plurality of holding pillars evenly arranged around the perimeter of the two-dimensional layer, each holding pillar comprising a first holding member and a second holding member of the at least two holding members; wherein each of the at least two holding members comprises and inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space; wherein the first holding member comprises an electrically conductive material; and wherein the first and second holding members are in physical contact with each other along mutually complementary surfaces so that the outward surface of the holding member is in physical contact with the inward surface of the second holding member. ### Claim 16 An array, comprising a plurality of layer structures, wherein the layer structure comprises: a carrier; a two-dimensional layer comprising a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface; and a holding structure; wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the first surface of the two-dimensional layer is in contact with the holding structure and the second surface of the two-dimensional layer is free of the holding structure and the two-dimensional layer spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises at least two holding members being in physical contact with each other and having different thermal expansion characteristics; wherein each of the at least two holding members comprises an inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space; and wherein the outward surface of one of the at least two holding members is in physical contact with the inward surface of another one of the at least two holding members. ### Claim 17 A layer structure, comprising: a carrier; a two-dimensional layer; and a holding structure; wherein the two-dimensional layer comprises a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface at the perimeter of the two-dimensional layer; wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the second surface of the two-dimensional layer is free of the holding structure and is spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer; wherein the holding structure comprises a plurality of holding pillars evenly arranged around the perimeter of the two-dimensional layer, each holding pillar comprising a holding portion and a contact portion; wherein the holding portion is arranged on the carrier beyond the edge surface of the two-dimensional layer so that the holding portion is not under the two-dimensional layer, the holding portion spans at least a distance of the empty space between the carrier and the second surface of the two-dimensional layer; wherein the contact portion contacts the edge surface and the first surface of the two-dimensional layer; wherein each holding pillar comprises a first holding member and a second holding member where the thermal expansion characteristics of the first holding member is different from the thermal expansion characteristics of the second holding member; wherein each of the at least two holding members comprises and inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space; wherein the outward surface of the first holding member is in physical contact with the inward surface of the second holding member; wherein the first holding ,member ,comprises the ,contact portion; and wherein the first holding member comprises an electrically conductive material.