# US 10,369,793 B2 · Service structures in print heads

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- Number: US 10,369,793 B2
- Document ID: US10369793B2
- Status: Granted
- Kind: B2
- Application number: 15/747,619
- Filed: 2015-10-15
- Published: 2018-08-30
- Granted: 2019-08-06
- Earliest claimed: 2015-10-15
- Assignees: Hewlett-Packard Development Company, L.P.
- Applicants: Hewlett-Packard Development Company, L.P.
- Inventors: Devin Alexander Mourey; Chien-Hua Chen; Michael W. Cumbie
- Web page: https://patentgrep.com/patent/US10369793B2

## CPC

- B41J 2/1637: {molding}
- B41J 2/14: Structure thereof {only for on-demand ink jet heads}
- B41J 2/16: Production of nozzles
- B41J 2202/22: Manufacturing print heads
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.

## Claims

### Claim 1

An apparatus, comprising:
an epoxy molded compound (EMC);
at least one print head die embedded in the EMC; and
a service structure within the EMC located adjacent to the at least one print head die.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the service structure comprises a texture formed in the material of the EMC.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein the texture comprises a plurality of nano-structures.

### Claim 4 (depends on 2)

The apparatus of claim 2, wherein the texture comprises a plurality of ridges.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the service structure comprises an embedded service material having a low surface energy.

### Claim 6 (depends on 5)

The apparatus of claim 5, wherein the embedded service material is co-planer with the at least one print head die.

### Claim 7 (depends on 5)

The apparatus of claim 5, wherein the embedded service material comprises at least one of: a polyhexafluoroethylene, a polytetrafluoroethylene (PTFE), a poly(vinylidene fluoride) (PVF), a poly(chlorotrifluoroethylene), a polyethylene (PE), a polypropylene (PP), or a silica filler with a low surface energy coating in an epoxy matrix.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the service structure is located within 1 millimeter or less to the at least one print head die.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the service structure is spaced apart from the at least one print head die by 1 millimeter or less.

### Claim 10 (depends on 1)

The apparatus of claim 1, comprising two print head dies, the service structure being located between the two print head dies.

### Claim 11 (depends on 1)

The apparatus of claim 1, wherein the service structure comprises a separate structure that is embedded in the EMC.

### Claim 12

A method, comprising:
providing a structured carrier having a service structure;
applying a thermal release tape over the structured carrier; applying at least one print head die on the thermal release tape;
encapsulating the at least one print head die and an area that includes the service structure with an epoxy molding compound (EMC); and
removing the structured carrier and the thermal release tape,
wherein the service structure is transferred to the EMC as an embedded service structure, wherein the embedded service structure is adjacent to the at least one print head die.

### Claim 13 (depends on 12)

The method of claim 12, wherein the embedded service structure comprises a texture.

### Claim 14 (depends on 13)

The method of claim 13, wherein the texture comprises a plurality of nano-structures.

### Claim 15 (depends on 13)

The method of claim 13, wherein the texture comprises a plurality of ridges.

### Claim 16

A method, comprising: providing a structured carrier;
applying a thermal release tape over the structured carrier;
applying at least one print head die on the thermal release tape;
applying a service structure on the thermal release tape adjacent to the at least one print head die;
encapsulating the at least one print head die and the service structure with an epoxy molding compound (EMC); and
removing the structured carrier and the thermal release tape to form an embedded service structure adjacent to the at least one print head die.

### Claim 17 (depends on 16)

The method of claim 16, wherein the embedded service structure comprises an embedded service material.

### Claim 18 (depends on 17)

The method of claim 17, wherein the embedded service material comprises at least one of: a polyhexafluoroethylene, a polytetrafluoroethylene (PTFE), a poly(vinylidene fluoride) (PVF), a poly(chlorotrifluoroethylene), a polyethylene (PE), a polypropylene (PP), or a silica filler with a low surface energy coating in an epoxy matrix.

### Claim 19 (depends on 16)

The method of claim 16, wherein the service structure is spaced apart from the at least one print head die by 1 millimeter or less.

### Claim 20 (depends on 16)

The method of claim 16, further comprising applying two print head dies, the service structure being located between the two print head dies.