# US 10,369,774 B2 · Thermally conductive de-bonding aid > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,369,774 B2 - Document ID: US10369774B2 - Status: Granted - Kind: B2 - Application number: 15/639,581 - Filed: 2017-06-30 - Published: 2019-01-03 - Granted: 2019-08-06 - Earliest claimed: 2017-06-30 - Assignees: Microsoft Technology Licensing, LLC - Applicants: Microsoft Technology Licensing, LLC - Inventors: James Michael Bonicatto; Han Li; David John Huston; James David Holbery; Siyuan Ma - Web page: https://patentgrep.com/patent/US10369774B2 ## CPC - B32B 43/006: {Delaminating} - B32B 41/00: Arrangements for controlling or monitoring lamination processes; Safety arrangements - G06F 1/1637: {Details related to the display arrangement, including those related to the mounting of the display in the housing} - G06F 3/0412: {Digitisers structurally integrated in a display} - B32B 2315/08: Glass - B32B 2457/208: Touch screens - G02F 1/133331: {Cover glasses} - G02F 2202/28: Adhesive materials or arrangements - Y10S 156/924: Delaminating display screen, e.g. cathode-ray, LCD screen - Y10T 156/1158: Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.] - Y10T 156/1917: Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.] - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device. ## Claims ### Claim 1 A computing device display comprising: a chassis; a cover glass; a thermally sensitive adhesive oriented between the cover glass and the chassis and extending about an entire perimeter of the display; a mask also oriented between the cover glass and the chassis and extending about the entire perimeter of the display; and a thermally conductive de-bonding aid including passive thermally conductive portions of the mask located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display. ### Claim 2 (depends on 1) The computing device display of claim 1, wherein the thermally conductive de-bonding aid further includes an active de-bonding aid. ### Claim 3 (depends on 2) The computing device display of claim 2, wherein the active de-bonding aid includes a resistive electrical circuit. ### Claim 4 (depends on 1) The computing device display of claim 1, wherein the sensitive component is one of a camera and an antenna. ### Claim 5 (depends on 1) The computing device display of claim 1, wherein the thermally conductive de-bonding aid is screen-printed onto the cover glass. ### Claim 6 (depends on 1) The computing device display of claim 1, wherein the thermally sensitive adhesive includes a thermally conductive powder entrained therein. ### Claim 7 A method of disassembling a computing device display comprising: providing a mask oriented between a cover glass and a chassis and extending about an entire perimeter of the display; conducting thermal energy through the cover glass to a thermally conductive de-bonding aid including passive thermally conductive portions of the mask located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display, wherein the thermally conductive de-bonding aid heats a thermally sensitive adhesive also oriented between the cover glass and the chassis and extending about the entire perimeter of the display; and lifting the cover glass from the chassis. ### Claim 8 (depends on 7) The method of claim 7, further comprising: securing the chassis to a fixture prior to conducting the thermal energy to the thermally conductive de-bonding aid; and attaching the cover glass to a lifting mechanism prior to conducting the thermal energy to the thermally conductive de-bonding aid. ### Claim 9 (depends on 8) The method of claim 8, wherein the thermal energy is applied via the lifting mechanism. ### Claim 10 (depends on 7) The method of claim 7, further comprising: applying a lifting force to the cover glass; and monitoring one or both of a magnitude of the lifting force applied to the cover glass and a time elapsed that the lifting force is applied to the cover glass. ### Claim 11 (depends on 7) The method of claim 7, further comprising: iteratively repeating the conducting thermal energy operation and the lifting the cover glass operation. ### Claim 12 (depends on 7) The method of claim 7, further comprising: simultaneously performing the conducting thermal energy operation and the lifting the cover glass operation. ### Claim 13 (depends on 7) The method of claim 7, wherein the sensitive component is one of a camera and an antenna. ### Claim 14 (depends on 7) The method of claim 7, wherein the thermally sensitive adhesive includes a thermally conductive powder entrained therein. ### Claim 15 (depends on 7) The method of claim 7, further comprising: applying electrical energy to the thermally conductive de-bonding aid further including a resistive electrical circuit. ### Claim 16 A computing device display comprising: a chassis; a cover glass; a thermally sensitive adhesive oriented between the cover glass and the chassis and extending about an entire perimeter of the display; a passive array of thermally conductive de-bonding pads also oriented between the cover glass and the chassis and located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display; and an active de-bonding aid also oriented between the cover glass and the chassis and located in one or more other discrete sections of the perimeter of the display also spaced apart from the sensitive component mounted within the display, the active de-bonding aid to apply thermal energy to the computing device display and the passive array to direct thermal energy away from the sensitive component and toward the thermally sensitive adhesive. ### Claim 17 (depends on 16) The computing device display of claim 16, wherein the sensitive component is one of a camera and an antenna.