# US 10,369,663 B1 · Laser process with controlled polarization

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- Number: US 10,369,663 B1
- Document ID: US10369663B1
- Status: Granted
- Kind: B1
- Application number: 14/727,668
- Filed: 2015-06-01
- Granted: 2019-08-06
- Earliest claimed: 2014-05-30
- Assignees: Gentex Corporation
- Applicants: Gentex Corporation
- Inventors: Kurtis L. Geerlings; Donald L. Bareman; David J. Cammenga; Niels A. Olesen
- Web page: https://patentgrep.com/patent/US10369663B1

## CPC

- B23K 26/359: by providing a line or line pattern, e.g. a dotted break initiation line
- B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/064: by means of optical elements, e.g. lenses, mirrors or prisms
- C30B 29/20: Aluminium oxides
- C30B 33/02: Heat treatment (C30B33/04, C30B33/06 take precedence)
- C30B 33/06: Joining of crystals
- G02B 5/3025: {Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state (G02B5/3008, G02B5/3016 take precedence)}
- G02B 5/3083: {Birefringent or phase retarding elements (G02B5/3008, G02B5/3016 take precedence; systems for polarisation control G02B27/286; manufacturing phase modulating patterns by lithographic processes G03F7/001)}
- G02B 26/06: for controlling the phase of light (G02B26/08 takes precedence {, measuring optical phase difference G01J9/00})
- G02B 27/286: {for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another (G02B5/3083 takes precedence; light guide coupling means utilising polarising elements G02B6/34)}
- H01S 3/0085: {Modulating the output, i.e. the laser beam is modulated outside the laser cavity}
- B23K 2103/56: {being semiconducting}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C30B: SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, B01J3/06); UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL (zone-refining of metals or alloys C22B); PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE (casting of metals, casting of other substances by the same processes or devices B22D; working of plastics B29; modifying the physical structure of metals or alloys C21D, C22F); SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE (for producing semiconductor devices or parts thereof H10); APPARATUS THEREFOR
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

A laser system and method includes control of the direction of polarization of a laser beam that forms laser-induced channels in a substrate along a process path. Control of the direction of polarization is useful while forming laser-induced channels in substrate materials having a crystalline component. An optical element, such as a waveplate, imparts the laser beam with a direction of polarization that is controllable with respect to an axis of the substrate when the substrate is supported by the system for processing. The direction of polarization is changeable and controllable with respect to the direction of the process path and/or a crystalline plane of the substrate via movement of the optical element or the substrate or both.

## Claims

### Claim 1

A method comprising:
directing a laser beam of a laser system toward a substrate that is at least partially transparent to the laser beam, the laser system being configured to form laser-induced channels in the substrate, wherein the laser beam passes through a waveplate prior to impinging the substrate;
forming the laser-induced channels in the substrate at a plurality of spaced apart locations along a process path, wherein an instantaneous direction of the process path relative to a direction of a crystalline plane of the substrate defines a process path angle, and wherein at least a portion of the process path is angled relative to the direction of the crystalline plane of the substrate; and
selectively rotating at least one of the waveplate or the substrate to control a polarization angle of the laser beam to provide a desired characteristic of the laser-induced channels, wherein the at least one of the waveplate or the substrate is rotated to control the polarization angle based on (i) an instantaneous direction of polarization of the laser beam and (ii) the process path angle of the process path relative to the direction of the crystalline plane of the substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein the process path extends in at least a first direction and a second direction such that the process path angle varies along the process path, and wherein the process path deviates from a straight line along at least one of a curved path or a perpendicular path.

### Claim 3 (depends on 1)

The method of claim 1, wherein the substrate comprises sapphire.

### Claim 4 (depends on 1)

The method of claim 1, wherein an angle between the instantaneous direction of polarization and the instantaneous direction of the process path is constant along the process path.

### Claim 5 (depends on 1)

The method of claim 1, wherein the at least one of the waveplate or the substrate is rotated such that the polarization angle and the process path angle are the same along at least a portion of the process path such that the instantaneous direction of the process path and the instantaneous direction of polarization are parallel.

### Claim 6 (depends on 1)

The method of claim 1, wherein the at least one of the waveplate or the substrate is rotated such that the polarization angle and the process path angle are different along at least a portion of the process path such that the instantaneous direction of the process path and the instantaneous direction of polarization are non-parallel.

### Claim 7 (depends on 6)

The method of claim 6, wherein the laser-induced channels along at least the portion of the process path include microcracks that extend between adjacent laser-induced channels.

### Claim 8 (depends on 5)

The method of claim 5, wherein the laser-induced channels along the portion of the process path do not include microcracks that extend between adjacent laser-induced channels.

### Claim 9

A method comprising:
directing a laser beam of a laser system toward a substrate that is at least partially transparent to the laser beam, the laser system configured to form laser-induced channels in the substrate, wherein the laser beam passes through a waveplate prior to impinging the substrate;
forming the laser-induced channels in the substrate at a plurality of spaced apart locations along a process path, wherein at least a portion of the process path is angled relative to a direction of a crystalline plane of the substrate; and
selectively rotating at least one of the waveplate or the substrate wherein the at least one of the waveplate or the substrate is rotated to control a polarization angle of the laser beam based on (i) an instantaneous direction of polarization of the laser beam and (ii) an instantaneous direction of the process path relative to the direction of the crystalline plane of the substrate.

### Claim 10 (depends on 9)

The method of claim 9, wherein the instantaneous direction of polarization is non-parallel with the instantaneous direction of the process path for at least a portion of the process path.
