# US 10,368,840 B2 · Ultrasonic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,368,840 B2 - Document ID: US10368840B2 - Status: Granted - Kind: B2 - Application number: 16/052,729 - Filed: 2018-08-02 - Published: 2019-02-07 - Granted: 2019-08-06 - Earliest claimed: 2017-08-03 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Yoshio Arai; Kazuki Yoshida - Web page: https://patentgrep.com/patent/US10368840B2 ## CPC - A61B 8/4494: {characterised by the arrangement of the transducer elements} - A61B 8/4427: {Device being portable or laptop-like} - A61B 8/4444: {related to the probe} - A61B 8/4488: {the transducer being a phased array} - A61B 8/461: {Displaying means of special interest} - A61B 8/467: {characterised by special input means} - A61B 8/56: {Details of data transmission or power supply} - B06B 1/0622: {on one surface} - B06B 1/0677: {and a high impedance backing} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) ## Abstract An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity. ## Claims ### Claim 1 An ultrasonic apparatus comprising: an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction; a first conductive film provided on a first side of the ultrasonic element substrate in the first direction; a protective member provided at the first side of the ultrasonic element substrate; a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate; a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being a thin film provided on a surface of the case, the case being made of a material having a resin; and a support substrate that is provided on a second side opposite to the first side in the first direction of the ultrasonic element substrate, the support substrate supporting the ultrasonic element substrate, the support substrate having conductivity, wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and the second conductive film is adhered to the conductive member via a conductive adhesive. ### Claim 2 (depends on 1) The ultrasonic apparatus according to claim 1, wherein the conductive member and the case are integrally formed with each other. ### Claim 3 (depends on 1) The ultrasonic apparatus according to claim 1, wherein a material of the first conductive film is copper. ### Claim 4 (depends on 1) The ultrasonic apparatus according to claim 1, wherein the first conductive film is provided with a plurality of holes. ### Claim 5 (depends on 1) The ultrasonic apparatus according to claim 1, further comprising: a flat cable through which an electric signal is transmitted to the ultrasonic element array; and a braided shield that surrounds the flat cable, wherein the support substrate is connected to the braided shield. ### Claim 6 An ultrasonic apparatus comprising: an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction; a first conductive film provided on a first side of the ultrasonic element substrate in the first direction; a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate, a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being a thin film provided on a surface of the base, the case being made of a material having a resin; a support substrate that is provided on a second side opposite to the first side in the first direction of the ultrasonic element substrate, the support substrate supporting the ultrasonic element substrate, the support substrate having conductivity; and an electric wave shield for the ultrasonic apparatus is configured with the first conductive film, the second conductive film, the conductive member, and the support substrate to enclose the ultrasonic element array, wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and the second conductive film is adhered to the conductive member via a conductive adhesive. ### Claim 7 (depends on 6) The ultrasonic apparatus according to claim 6, wherein the conductive member and the case are integrally formed with each other. ### Claim 8 (depends on 6) The ultrasonic apparatus according to claim 6, wherein a material of the first conductive film is copper. ### Claim 9 (depends on 6) The ultrasonic apparatus according to claim 6, wherein the first conductive film is provided with a plurality of holes. ### Claim 10 (depends on 6) The ultrasonic apparatus according to claim 6, further comprising: a flat cable through which an electric signal is transmitted to the ultrasonic element array; and a braided shield that surrounds the flat cable, wherein the support substrate is connected to the braided shield. ### Claim 11 An ultrasonic apparatus comprising: an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction; a first conductive film provided on a first side of the ultrasonic element substrate in the first direction; a protective member provided at the first side of the ultrasonic element substrate; a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate; a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being disposed at a second side opposite to the first side in the first direction of the ultrasonic element substrate; and a support substrate that is provided on the second side of the ultrasonic element substrate, the support substrate support the ultrasonic element substrate, the support substrate having conductivity, wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and the second conductive film is adhered to the conductive member via a conductive adhesive. ### Claim 12 (depends on 11) The ultrasonic apparatus according to claim 11, wherein the conductive member and the case are integrally formed. ### Claim 13 (depends on 11) The ultrasonic apparatus according to claim 11, wherein a material of the first conductive film is copper. ### Claim 14 (depends on 11) The ultrasonic apparatus according to claim 11, wherein the first conductive film is provided with a plurality of holes. ### Claim 15 (depends on 11) The ultrasonic apparatus according to claim 11, further comprising: a flat cable through which an electric signal is transmitted to the ultrasonic element array; and a braided shield that surrounds the flat cable, wherein the support substrate is connected to the braided shield.