Thermal chamber exhaust structure and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Chang Hsieh, Chun-Chih Lin, Tah-te Shih, Wen-Hsong Wu, Chune-Te Yang, Yu-Jen Su
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Chang Hsieh, Chun-Chih Lin, Tah-te Shih, Wen-Hsong Wu, Chune-Te Yang, Yu-Jen Su
Estimating the term…
An exhaust structure includes an intake section including a first high thermal conductivity material, the intake section having an inlet, an output section including a second high thermal conductivity material, the output section having an outlet, and a piping section including a third high thermal conductivity material, the piping section being configured to communicatively couple the intake section with the output section. The exhaust structure provides a high thermal conductivity path from the inlet to the outlet, the high thermal conductivity path including the first high thermal conductivity material, the second high thermal conductivity material, and the third high thermal conductivity material.
An exhaust structure comprising:
A thermal chamber system comprising:
A method of exhausting a vapor, the method comprising:
Dependencies are inferred from the claim text.