Analysis system and analysis method
AssigneeHamamatsu Photonics K.K.
InventorTomonori Nakamura
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Abstract
A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.
Claims12
An analysis system identifying a heat source position inside a measurement object, the analysis system comprising:
- an applying unit configured to apply an AC signal to the measurement object;
- a light detector configured to detect light from the measurement object according to the AC signal and outputting a detection signal;
- and
- an analyzer configured to identify the heat source position based on the detection signal,
- wherein the applying unit is configured to apply the AC signal with an amplitude in an OFF period of a lock-in cycle that is smaller than in an ON period of the lock-in cycle according to a trigger signal with a predetermined lock-in cycle.
An analysis method for identifying a heat source position inside a measurement object, the analysis method comprising:
- applying an AC signal to the measurement object;
- detecting light from the measurement object according to the AC signal and outputting a detection signal;
- and
- identifying the heat source position based on the detection signal,
- wherein applying the AC signal comprises applying the AC signal with an amplitude in an OFF period of a lock-in cycle that is smaller than in an ON period of the lock-in cycle according to a trigger signal with a predetermined lock-in cycle.
Dependencies are inferred from the claim text.