Process for manufacturing a hybrid timepiece component

A process for manufacturing a hybrid timepiece component, comprising:

• providing a substrate, at least an upper surface of which is conductive;
• forming a first resist mold on top of the upper surface of the substrate, the first resist mold comprising at least one material-free zone on top of the substrate;
• structuring at least one wafer of a first micromachinable material and depositing the at least one wafer on top of the first resist mold or conversely positioning at least one wafer of a first micromachinable material on top of the first resist mold and structuring the at least one wafer so as to form at least one through-opening of the at least one wafer at least partially superposed on a material-free zone of the first resist mold, the structured wafer being intended to form a first part of the hybrid timepiece component;
• forming a second resist mold on top of the wafer, comprising material-free zones that extend from the upper surface of the substrate to the upper surface of the stack;
• depositing a metal or an alloy by electroforming, so that the metal extends from the upper surface of the substrate to the top of the wafer through the through-opening and over the two upper and lower faces of the wafer as a single piece resulting from one and the same electroforming, the electroformed metal being intended to form a second part of the hybrid timepiece component;
• and
• releasing the hybrid timepiece component by the removal of the substrate.