Composite body and method for manufacturing same
AssigneeDenka Company Limited
InventorsYosuke Ishihara, Takeshi Miyakawa, Shinya Narita
Life of this patent
Estimating the term…
Abstract
A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.
Claims6
A composite obtained by press-molding a mixed powder comprising 20-50 vol % of an aluminum powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6.
A method for manufacturing a composite, comprising the steps of:
- filling a mold with a mixed powder comprising 20-50 vol % of an aluminum powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6;
- heating the mixed powder to a temperature of at least 300° C. and less than 660° C.;
- and
- press-molding at a molding pressure of 10-300 MPa for a pressing time of 1-30 minutes.
Dependencies are inferred from the claim text.