Rear-projection photodetection yarn clearing apparatus and ultraviolet enhanced silicon photodiode thereof
AssigneeShanghai Institute of Kehua Optoelectronic Techniques
InventorsHejian Peng, Zuoliang Wu
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AssigneeShanghai Institute of Kehua Optoelectronic Techniques
InventorsHejian Peng, Zuoliang Wu
Estimating the term…
A rear-projection photodetection yarn clearing apparatus includes a light emitting diode and a detector arranged behind a to-be-detected yarn, and further includes a reflector arranged in front of the to-be-detected yarn. A front end face of the light emitting diode is flush with a photosurface of the detector, a light filter for capturing light rays having a waveband from 330 nm to 470 nm is also arranged in front of the light emitting diode and the detector, and a light-reflecting surface of the reflector is in parallel with the photosurface of the detector. The light emitting diode includes an ultraviolet light emitting diode, and the detector includes an ultraviolet enhanced silicon photodiode. The ultraviolet enhanced silicon photodiode is made from a high-resistivity N-type (111) silicon wafer having a resistivity of 3,000 Ω·cm and a field oxide thickness of 1,000 nm.
A rear-projection photodetection yarn clearing apparatus, comprising a light emitting diode and a detector arranged behind a to-be-detected yarn, and further comprising a reflector arranged in front of the to-be-detected yarn, wherein a front end face of the light emitting diode is flush with a photosurface of the detector, a light filter for capturing light rays having a waveband ranging from 330 nm to 470 nm is further arranged in front of the light emitting diode and the detector, a light-reflecting surface of the reflector is in parallel with the photosurface of the detector;
An ultraviolet enhanced silicon photodiode, made from a high-resistivity N-type (111) silicon wafer having a resistivity of 3,000Ω·cm and a field oxide thickness of 1,000 nm, wherein a side of the silicon wafer is implanted with boron having an implantation dose of 4×1014 cm−2˜5×1014 cm−2 and energy of 30 Kev to form a P-type area, another side of the silicon wafer is implanted with phosphorus having an implantation dose of 5×1015 cm−2 and energy of 100 Kev to form an N+ area, the P-type area of the silicon wafer is polished, the N+ area of the silicon wafer is burnished, and both the P-type area and the N+ area have an oxide layer thickness of 50 nm˜60 nm.
Dependencies are inferred from the claim text.