Device and method for on-chip mechanical stress sensing
AssigneeTexas Instruments Incorporated
InventorsUmidjon Nurmetov, Ralf Peter Brederlow, Baher Haroun
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AssigneeTexas Instruments Incorporated
InventorsUmidjon Nurmetov, Ralf Peter Brederlow, Baher Haroun
Estimating the term…
An integrated circuit (IC) chip includes a substrate of a piezo-electric material having a first resistivity coefficient associated with a first direction that is longitudinal to a first crystal axis and a second resistivity coefficient associated with a second direction that is transverse to the first crystal axis. The first and second resistivity coefficients have opposite signs. The IC chip also includes a first stress sensing element formed in the substrate and coupled to pass a first current therethrough. The first stress sensing element includes a first resistor aligned such that the major direction of current flow through the first resistor is in the first direction and a second resistor coupled in series with the first resistor and aligned such that the major direction of current flow through the second resistor is in the second direction. A ratio of the resistance of the second resistor to the resistance of the first resistor is equal to a value α, where α is equal to the ratio of the first resistivity coefficient to the second resistivity coefficient.
An integrated circuit (IC) chip comprising:
An integrated circuit (IC) chip comprising:
An integrated circuit (IC) chip comprising:
Dependencies are inferred from the claim text.