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US 10,351,461 B2Granted
Method for dividing brittle substrate
AssigneeMITSUBOSHI DIAMOND INDUSTRlAL CO., LTD.
InventorHiroshi Soyama
Life of this patent
Estimating the term…
Abstract
A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.
Claims7
A method for dividing a brittle substrate, the method comprising:
- preparing a brittle substrate including a first surface and having a thickness direction perpendicular to said first surface;
- pressing a cutter edge against said first surface of said brittle substrate;
- forming a trench line having a groove shape by causing said cutter edge pressed in said pressing step to slide on said first surface of said brittle substrate to generate a plastic deformation on said first surface of said brittle substrate, said step of forming a trench line being performed to obtain a crack-free state in which said brittle substrate retains seamless continuity in a direction crossing said trench line, directly below said trench line, and along said trench line;
- maintaining said crack-free state after said forming a trench line;
- after said step of maintaining said crack-free state, forming a crack line in said thickness direction and along said trench line, said crack line breaking said seamless continuity of said brittle substrate in the direction crossing said trench line, directly below said trench line, and along said trench line;
- and
- dividing said brittle substrate along said crack line.
4 more elements
Dependencies are inferred from the claim text.