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US 10,346,647 B2Granted
Configuring signal devices in thermal processing systems
AssigneeHypertherm, Inc.
InventorsMichael Hoffa, E. Michael Shipulski
Life of this patent
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AssigneeHypertherm, Inc.
InventorsMichael Hoffa, E. Michael Shipulski
Estimating the term…
In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.
A material processing head for reducing communication interference between data tags and an antenna, the material processing head comprising:
A method of facilitating communication, and reducing communication interference, between an RFID tag reader of a material processing head of a material processing system and two or more RFID tags associated consumable components disposed within the material processing head, the method comprising:
Dependencies are inferred from the claim text.