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US 10,342,138 B2Granted
Chip part and manufacturing method thereof
AssigneeRohm Co., Ltd.
InventorsYasuhiro Kondo, Katsuya Matsuura, Hiroshi Tamagawa
Life of this patent
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Abstract
A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
Claims6
A chip part comprising:
- a substrate having a first main surface on one side thereof and a second main surface on the other side thereof;
- a functional device formed at a first main surface side of the substrate;
- an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device;
- and
- a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate,
- wherein the light diffusion reflection structure is formed by an uneven structure formed at the second main surface side of the substrate, and
- the chip part further comprises an insulating film covering the second main surface of the substrate.
4 more elements
Dependencies are inferred from the claim text.