Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same

A pressure-sensitive adhesive film satisfying Equation 1, comprising:

• a pressure-sensitive adhesive having a water vapor transmission rate of 50 g/m2·day or less in a thickness direction, wherein the water vapor transmission rate is measured according to a specification of ASTM F1249:
• ΔX≤0.3 mm [Equation 1]
• wherein ΔX is a change in a creeping distance of a pressure-sensitive adhesive layer between 50 to 200 seconds when a base film, in which the pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive is formed to have a thickness of 50 μm on one surface thereof, is adhered to a glass plate having an adhesive area of 1 cm2, and aged for 24 hours, and then an 1 kg load is applied thereto at 80° C. for 1000 seconds, and
• wherein the pressure-sensitive adhesive comprises a pressure-sensitive adhesive composition comprising:
• an encapsulating resin which is a polyolefin-based resin or elastomer;
• and a multifunctional active energy ray-polymerizable compound,
• wherein the pressure-sensitive adhesive film has a loss factor (tan δ) of 0.05 to 0.25 at 80° C. and a frequency of 1 Hz, and
• wherein the active energy ray-polymerizable compound satisfies Formula 1:
• wherein R1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue derived from a cyclic alkyl group having 3 to 30 carbon atoms.