Electronic gaming die

A method for manufacturing an electronic gaming die comprising the steps of:

• fabricating a flexible substrate that folds into N sides where N is equal to or greater than 4, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N, a number of light emitting diodes disposed on the outer face of each side of the flexible substrate such that the number of light emitting diodes equals the integer assigned to the side of the flexible substrate, a sensor is disposed on one of the inner faces of the flexible substrate, a processor is disposed on one of the inner faces of the flexible substrate and communicably coupled to the sensor and the one or more light emitting diodes, and a battery is disposed on one of the inner faces of the flexible substrate and electrically connected to the one or more light emitting diodes, the sensor and the processor;
• providing an enclosure having N sides;
• folding the flexible substrate such that the folded flexible substrate fits into an interior of the enclosure;
• inserting the folded flexible substrate into the interior of the enclosure;
• and sealing the enclosure.