Method for manufacturing a liquid-surface detection device
AssigneeDenso Corporation
InventorYoshifumi Terada
Life of this patent
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Abstract
A liquid-surface detection device includes terminals and an electronic component that has a body portion and a lead portion projecting from the body portion and being connected to the terminals. A method for manufacturing the liquid-surface detection device includes arranging the electronic component in a casing that has a mounting surface and covers the terminals, and connecting the lead portion and the terminals. The mounting surface has a base surface with a planar shape, an island projecting from the base surface and a hole recessed from the base surface. The lead portion is placed in a positioning groove of the island. A curved surface of the body portion is supported by an edge of the hole. Accordingly, a yield can be increased.
Claims5
A method for manufacturing a liquid-surface detection device comprising:
- providing a plurality of terminals for outputting an electrical signal corresponding to a detection result from a detecting element portion that is connected to the plurality of terminals, and that is detecting a level of a liquid-surface of a liquid stored in a container, to an outside of the container, and
- an electronic component connected to corresponding one of the plurality of terminals, the electronic component having
- a body portion, and
- a lead portion projecting from the body portion;
- molding a casing that covers the plurality of terminals, the casing having a mounting surface that includes
- a base surface with a planar shape and extending parallel to a direction in which the plurality of terminals extends,
- an extension projecting from the base surface in a direction perpendicular to the direction in which the plurality of terminals extends, the extension further defining a positioning groove, and
- a hole recessed from the base surface towards the plurality of the terminals;
- arranging the lead portion and the body portion of the electronic component after the molding, so that the lead portion is placed in the positioning groove to extend along the base surface, the positioning groove having a clearance from the lead portion, and a curved surface of the body portion of the electronic component projecting toward the mounting surface is held by an edge of the hole;
- and
- after the arranging, connecting the lead portion of the electronic component and the corresponding one of the plurality of terminals.
Dependencies are inferred from the claim text.