US 10,330,397 B2 · Water-cooling heat dissipating system and water-cooling head

Abstract

A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

Drawings

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Drawings

Claims13

Dependent claims

A water-cooling heat dissipating system for an electronic device, the water-cooling heat dissipating system comprising:

a pump for moving a liquid along a circulating loop;
a first water-cooling head comprising:
a first base in contact with a first electronic component of the electronic device;
a first chamber located over the first base, and comprising a first inlet and a first outlet, wherein the first inlet and the first outlet are in fluid communication with the outside of the first chamber, the first inlet is in fluid communication with the pump, and the liquid is inputted into the first chamber through the first inlet;
and
a second chamber located over the first base, separated from the first chamber, and comprising a second inlet and a second outlet, wherein the second inlet and the second outlet are in fluid communication with the outside of the second chamber, and the liquid is inputted into the second chamber through the second inlet,
wherein the liquid continuously flows through the first chamber and the second chamber, and a heat from the first electronic component during operation is transferred to the liquid within the first chamber and the second chamber through the first base, wherein after the heat is absorbed by the liquid within the first chamber and the second chamber, the heat is externally released from the first outlet and the second outlet through the liquid;
and
a second water-cooling head comprising:
a second base in contact with a second electronic component of the electronic device;
a third chamber located over the second base, and comprising a third inlet and a third outlet, wherein the third inlet and the third outlet are in fluid communication with the outside of the third chamber, the third inlet is in fluid communication with the first outlet, and the liquid is inputted into the third chamber through the third inlet;
and
a fourth chamber located over the second base, separated from the third chamber, and comprising a fourth inlet and a fourth outlet, wherein the fourth inlet and the fourth outlet are in fluid communication with the outside of the fourth chamber, the fourth inlet is in fluid communication with the third outlet, and the liquid is inputted into the fourth chamber through the fourth inlet,
wherein the second inlet is in fluid communication with the fourth outlet, and the second inlet is in fluid communication with the first outlet through the fourth outlet, the fourth inlet, the third outlet and the third inlet,
wherein the liquid continuously flows through the third chamber and the fourth chamber, and a heat from the second electronic component during operation is transferred to the liquid within the third chamber and the fourth chamber through the second base, wherein after the heat is absorbed by the liquid within the third chamber and the fourth chamber, the heat is externally released from the third outlet and the fourth outlet through the liquid.

12 more elements

A first water-cooling head and a second water-cooling head for use with a pump and an electronic device, the pump moving a liquid along a circulating loop, the electronic device comprising a first electronic component and a second electronic component, the first water-cooling head comprising:

a first base in contact with the first electronic component;
a first chamber located over the first base, and comprising a first inlet and a first outlet, wherein the first inlet and the first outlet are in fluid communication with the outside of the first chamber, the first inlet is in fluid communication with the pump, and the liquid is inputted into the first chamber through the first inlet;
and
a second chamber located over the first base, separated from the first chamber, and comprising a second inlet and a second outlet, wherein the second inlet and the second outlet are in fluid communication with the outside of the second chamber, and the liquid is inputted into the second chamber through the second inlet,
wherein the liquid continuously flows through the first chamber and the second chamber, and a heat from the first electronic component during operation is transferred to the liquid within the first chamber and the second chamber through the first base, wherein after the heat is absorbed by the liquid within the first chamber and the second chamber, the heat is externally released from the first outlet and the second outlet through the liquid;
and
the second water-cooling head comprising:
a second base in contact with the second electronic component;
a third chamber located over the second base, and comprising a third inlet and a third outlet, wherein the third inlet and the third outlet are in fluid communication with the outside of the third chamber, the third inlet is in fluid communication with the first outlet, and the liquid is inputted into the third chamber through the third inlet;
and
a fourth chamber located over the second base, separated from the third chamber, and comprising a fourth inlet and a fourth outlet, wherein the fourth inlet and the fourth outlet are in fluid communication with the outside of the fourth chamber, the fourth inlet is in fluid communication with the third outlet, and the liquid is inputted into the fourth chamber through the fourth inlet,
wherein the second inlet is in fluid communication with the fourth outlet, and the second inlet is in fluid communication with the first outlet through the fourth outlet, the fourth inlet, the third outlet and the third inlet,
wherein the liquid continuously flows through the third chamber and the fourth chamber, and a heat from the second electronic component during operation is transferred to the liquid within the third chamber and the fourth chamber through the second base, wherein after the heat is absorbed by the liquid within the third chamber and the fourth chamber, the heat is externally released from the third outlet and the fourth outlet through the liquid.

10 more elements

Dependencies are inferred from the claim text.

Description6,935 words

Summary2,333 words

#The present invention relates to a water-cooling heat dissipating system and a water-cooling head, and more particularly to a water-cooling heat dissipating system for an electronic device and with one or plural water-cooling heads and the structure of the water-cooling head.

#With increasing development of science and technology, various electronic devices (or computers) such as notebook computers, desktop computers or network servers have become indispensable devices in daily lives of people. Generally, during the operation of the electronic device, the temperature of the electronic components of the electronic device gradually increases. The elevated temperature may result in damage of the electronic components. For solving these problems, the electronic device is usually equipped with a heat dissipating mechanism. In accordance with a conventional heat dissipating mechanism, a fan is used to produce airflow to cool the electronic component through convection, or a heat dissipating unit made of a special material is attached on the electronic component to reduce the temperature through thermal conduction. In addition, a water cooling mechanism is one of the effective and common heat dissipating mechanisms.

#The operating principles of the water cooling mechanism will be described as follows. Generally, the water cooling mechanism uses liquid (e.g., water or coolant) as the cooling medium, and uses a continuously-running pump to move the liquid within an applied system along a circulating loop. The liquid flows along sealed pipes. The pipes are distributed to the surfaces of the electronic components (e.g., the central processing unit). When the liquid with the lower temperature flows through the electronic component with the higher temperature, the liquid absorbs the heat from the electronic component to decrease the temperature of the electronic component. Then, through heat exchange, the heat is released from the pipes to the surroundings or another heat dissipating mechanism. Consequently, the temperature of the liquid is decreased. Then, the liquid flows back to the system and flows along the circulating loop to remove the heat.

Brief description of the drawings7 figures

#FIG. 1 is a schematic top view illustrating the architecture of a conventional water cooling mechanism;

#FIG. 2 is a schematic top view illustrating the architecture of a water-cooling heat dissipating system according to a first embodiment of the present invention;

#FIG. 3 is a schematic cross-sectional side view illustrating the water-cooling head of the water-cooling heat dissipating system as shown in FIG. 2;

Detailed description4,437 words

#The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.

#A water-cooling heat dissipating system according to a first embodiment of the present invention will be described as follows. FIG. 2 is a schematic top view illustrating the architecture of a water-cooling heat dissipating system according to a first embodiment of the present invention. The water-cooling heat dissipating system 200 comprises a pump 20 and a water-cooling head 2. The water-cooling heat dissipating system 200 is applied to an electronic device (not shown). For example, the electronic device is a computer. According to the condition or requirement, the pump 20 can be disposed within the electronic device or disposed outside the electronic device. The pump 20 is used for transferring a liquid along a circulating loop in order to dissipate heat through the water cooling mechanism.

#In this embodiment, other heat dissipating mechanism and the details paths of the pipes are not shown in the drawing. For example, the radiator for allowing the heat exchange between the liquid and the surroundings and the water tank for storing the liquid are not shown. It is noted that these components may be installed according to the existing technologies and practical requirements. In FIG. 1, the liquid flows along a direction indicated by an arrow. Moreover, three pipes 81, 82 and 83 of the water-cooling heat dissipating system 200 are distributed inside or outside the electronic device according to the installation of the radiator or the water tank.

Facts

Application

16/105,355Filed 20 Aug 2018

Priority

TW 106133427 A28 Sep 2017

Published

US 2019/0093963 A128 Mar 2019

Granted

25 Jun 2019

Term ends

20 Aug 2038

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification12 codes

F28F 3/12
Plate-like or laminated elements; Assemblies of plate-like or laminated elements: elements constructed in the shape of a hollow panel, e.g. with…
G06F 1/20
Constructional details or arrangements: cooling means
H05K 7/20254
Using a liquid coolant without phase change in electronic enclosures: cold plates transferring heat from heat source to coolant
H05K 7/20263
Using a liquid coolant without phase change in electronic enclosures: heat dissipaters releasing heat from coolant

Timeline

28 Sep 2017Priority claimedTW 106133427 A
20 Aug 2018Application filedUS 16/105,355
21 Aug 2018Assigned to Auras Technology Co., Ltd.assignment of assignor's interest
28 Mar 2019PublishedUS 2019/0093963 A1
25 Jun 2019GrantedUS 10,330,397 B2
12 Oct 2026TodayWithin its term
20 Aug 2038Term endsEstimated

Water-cooling heat dissipating system and water-cooling head

Life of this patent

Water-cooling heat dissipating system and water-cooling head

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims13

Description6,935 words

Drawings

Classification12 codes

Life of this patent

Description6,935 words