Three-dimensional heat transfer device
AssigneeCooler Master Co., Ltd.
InventorsLei-Lei Liu, Xiao-Min Zhang
Life of this patent
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Abstract
A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
Claims35
A three-dimensional heat transfer device, comprising:
- a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body;
- and
- a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body,
- wherein the first capillary structure is connected to the second capillary structure by metallic bonding.
A three-dimensional heat transfer device, comprising:
- a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body;
- a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body;
- and
- a bonding layer connected to the first capillary structure and the second capillary structure, and the bonding layer comprising a porous structure.
A method of manufacturing a three-dimensional heat transfer device, comprising:
- providing a vapor chamber including a first capillary structure;
- providing a metal powder on at least a part of the first capillary structure;
- contacting a heat pipe including a second capillary structure to the metal powder;
- and
- performing a sintering process to sinter the metal powder to form a bonding layer,
- wherein the bonding layer is connected to the first capillary structure and the second capillary structure by metallic bonding.
A method of manufacturing a three-dimensional heat transfer device, comprising:
- providing a vapor chamber comprising a first capillary structure;
- providing a metal powder on at least part of the first capillary structure;
- contacting a heat pipe including a second capillary structure on the metal powder;
- and
- performing a sintering process to sinter the metal powder to form a bonding layer comprising a porous structure,
- wherein the bonding layer is connected to the first capillary structure and the second capillary structure.
Dependencies are inferred from the claim text.